Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Shao-Ping Shen"'
Publikováno v:
Chinese Journal of Contemporary Neurology and Neurosurgery, Vol 20, Iss 2, Pp 119-126 (2020)
Glioblastoma (GBM) is the most common and fatal primary adult brain tumor. To date,various promising chemotherapeutic regimens have been trialed for use in GBM; however, temozolomide(TMZ) therapy remains the only first ⁃ line chemotherapeutic optio
Externí odkaz:
https://doaj.org/article/f752a3d8aa1940a8ab40a416786b8dd7
Autor:
Shao-Ping Shen, 沈紹平
102
Recently, three-dimensional (3D) chip stacking has been paid significant attention. Interposer is a key connection component for the chip stacking, which serves as a bridge to connect multiple devices in z-direction. Glass has some significa
Recently, three-dimensional (3D) chip stacking has been paid significant attention. Interposer is a key connection component for the chip stacking, which serves as a bridge to connect multiple devices in z-direction. Glass has some significa
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/40575617155574188680
Autor:
Shao-Ping Shen, 沈紹平
98
The development of science and technology continuously progresses. Electronic components increasingly become small, thin, short and light. The evolution of semiconductor technology has reached a point where the packaging now plays an importan
The development of science and technology continuously progresses. Electronic components increasingly become small, thin, short and light. The evolution of semiconductor technology has reached a point where the packaging now plays an importan
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/99717834931596443594
Autor:
Bin Xu, Xiao-Bo Dong, Shuang Dai, Yao Wang, Guo-Zhen Zhang, Yan-En Lyu, Shao-Ping Shen, Min Feng, Hong-Yan Ju, Xiao-Fei Xu
Publikováno v:
World Journal of Clinical Cases
BACKGROUND Neurosurgical treatment of severe bilateral occipital lobe epilepsy usually involves two operations several mos apart. AIM To evaluate surgical resection of bilateral occipital lobe lesions during a single operation as a treatment for bila
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6bd73f2894f381c0c389292b3969fe27
https://doi.org/10.12998/wjcc.v9.i34.10518
https://doi.org/10.12998/wjcc.v9.i34.10518
Publikováno v:
DEStech Transactions on Computer Science and Engineering.
In this paper, a three-axis ultrasonic anemometer is presented which uses six ultrasonic transducers to obtain the wind speed, wind direction, etc. Every two transducers are used as transmitter and receiver of a short sequence of pulses. The time of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2639f619fceec7f698710f499bdd126
https://doi.org/10.12783/dtcse/wcne2017/19807
https://doi.org/10.12783/dtcse/wcne2017/19807
Publikováno v:
International journal of surgery (London, England). 51
Background Anterior temporal lobectomy (ATL) is the standard surgical treatment for temporal lobe epilepsy (TLE), but patients may suffer from recurrent seizures post-surgery. Invasive electrical monitoring plays a critical role in precisely identify
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::09e1d32024b0e8dc53eac73fd66d4546
https://pubmed.ncbi.nlm.nih.gov/29360612
https://pubmed.ncbi.nlm.nih.gov/29360612
Autor:
Wei-Ping Dow, Shao-Ping Shen
Publikováno v:
Journal of The Electrochemical Society. 161:D579-D585
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a89c8612693583003770bb6ec7b53d1
https://doi.org/10.1149/2.1061410jes
https://doi.org/10.1149/2.1061410jes
Autor:
Eric Cheng, Jing-Yuan Lin, Wu-Chung Chang, Shao-Ping Shen, Tohru Kamitamari, Wei-Hsiang Chen, Wei-Ping Dow
Publikováno v:
Microelectronic Engineering. 105:25-30
Through silicon via (TSV) is a key technology for three-dimensional chip stacking, which serves as a bridge to connect multiple devices in the z-direction. Void-free copper deposition in a TSV is essential for reliable TSV fabrication. Deep reactive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::472b85d2902dff77f68d7a462c88d950
https://doi.org/10.1016/j.mee.2012.12.017
https://doi.org/10.1016/j.mee.2012.12.017
Autor:
Motonobu Kubo, Yiu-Hsiang Chang, Eric Cheng, Jing-Yuan Lin, Tohru Kamitamari, Wei-Ping Dow, Chun-Wei Lu, Shao-Ping Shen, Fu-Chiang Hsu
Publikováno v:
International Symposium on Microelectronics. 2011:000645-000649
Three new technologies for Cu coating and deposition in through silicon vias (TSVs) and through silicon holes (TSHs) were developed. One is to synthesize Cu nanoparticles (CuNPs) with a particle size of 3–5 nm and then coat the CuNPs onto the sidew
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::288e2ebe143169aab1e7fc4592ea6c8a
https://doi.org/10.4071/isom-2011-wa6-paper1
https://doi.org/10.4071/isom-2011-wa6-paper1
Autor:
Yong-Chih Su, Chen-Chia Huang, Wei-Ping Dow, Shao-Ping Shen, Chih-Chan Li, Shar Hsu, Bob Hsu, Cliff Lee
Publikováno v:
Electrochimica Acta. 54:5894-5901
An organic additive, Diazine Black (DB), was employed as a leveler for microvia filling using copper electroplating. DB is a derivative of Janus Green B (JGB), which is a common leveler used for copper fill of submicron or micron circuit metallizatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ffc7da4c44a8b5107d43fb9f34e6c2ad
https://doi.org/10.1016/j.electacta.2009.05.053
https://doi.org/10.1016/j.electacta.2009.05.053