Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Shangtong Han"'
Autor:
Weike Zhao, Yingying Peng, Xiaoping Cao, Shi Zhao, Ruoran Liu, Yihui Wei, Dajian Liu, Xiaolin Yi, Shangtong Han, Yuanjian Wan, Kang Li, Guangze Wu, Jian Wang, Yaocheng Shi, Daoxin Dai
Publikováno v:
Nanophotonics. 11:4299-4313
The multi-dimensional multiplexing technology is very promising for further increasing the link capacity of optical interconnects. A 96-channel silicon-based on-chip reconfigurable optical add-drop multiplexer (ROADM) is proposed and demonstrated for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dbfb929ad78848b2bae0e1ee35cbf84e
https://doi.org/10.1515/nanoph-2022-0319
https://doi.org/10.1515/nanoph-2022-0319
Publikováno v:
IEEE Photonics Technology Letters. 33:765-768
We demonstrated an ultra-broadband dual-polarization power splitter based on silicon subwavelength gratings (SWGs). Multimode interference (MMI) couplers based on SWG are utilized for power splitting. SWGs with different orientations are combined to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f22a878b7ac8fcc76fd44d33797115e8
https://doi.org/10.1109/lpt.2021.3095257
https://doi.org/10.1109/lpt.2021.3095257
Publikováno v:
Optics Letters. 48:1331
We propose and demonstrate two types of 1 × 2 power splitters based on multimode interference (MMI), which are ultra-compact, fabrication friendly, and low loss. The contours of MMI and output tapers are optimized with Bezier curves, which can imple
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::574ff1fc0c45e3440fffda87261938fd
https://doi.org/10.1364/ol.485742
https://doi.org/10.1364/ol.485742
Autor:
Zhao, Weike, Peng, Yingying, Cao, Xiaoping, Zhao, Shi, Liu, Ruoran, Wei, Yihui, Liu, Dajian, Yi, Xiaolin, Han, Shangtong, Wan, Yuanjian, Li, Kang, Wu, Guangze, Wang, Jian, Shi, Yaocheng, Dai, Daoxin
Publikováno v:
Nanophotonics (21928606); Sep2022, Vol. 11 Issue 18, p4299-4313, 15p
Publikováno v:
IEEE Photonics Technology Letters; 8/1/2021, Vol. 33 Issue 15, p765-768, 4p