Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Shang-Tsai Wu"'
Publikováno v:
International Symposium on Microelectronics. 2013:000389-000396
Thin-wafer handling is one of the key enabling technologies for 2.5D/3D IC integration. Usually, it temporary bonds the TSV (through-silicon via)/RDL (redistribution layer) wafer (e.g., passive and active interposers) to a supporting carrier wafer wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a71415e4b3904b1ab84cd92cafd0df73
https://doi.org/10.4071/isom-2013-tp61
https://doi.org/10.4071/isom-2013-tp61
Publikováno v:
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
In this study, 3D IC integrations with a semi-embedded TSV interposer with stress relief gap under thermal operating and environmental conditions are investigated. Emphasis is placed on the determination of the TSV interposer warpage and the nonlinea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::986db152e9359e9638afe11ccc6cc282
https://doi.org/10.1109/esime.2012.6191796
https://doi.org/10.1109/esime.2012.6191796
Publikováno v:
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
In this study, 3D IC integrations with a TSV interposer supporting Moore's law chips on its top and bottom sides are investigated. Emphasis is placed on the determination of the TSV interposer warpage and the nonlinear stress and creep strain in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3de9b9b8b8e97ec56479d1ccddab66f7
https://doi.org/10.1109/esime.2012.6191797
https://doi.org/10.1109/esime.2012.6191797