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pro vyhledávání: '"Seungman Han"'
Autor:
David Dongwoo Park, Sukyoon Oh, Seungman Han, Yoonyoung Bae, Seong-Wook Choi, Young June Park
Publikováno v:
OFC
The Fan Out Wafer Level Packaging, widely used in the silicon semiconductor system, is introduced for all-in-one hybrid optical package with small form factor, potentially higher performance, and expendability to on-board/co-packaged optical intercon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ccb55b5398390ebc5e5e17a7f627fb2
https://doi.org/10.1364/ofc.2021.m2b.1
https://doi.org/10.1364/ofc.2021.m2b.1
