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Autor:
GyuIck Jung, SooHyun Kim, HoDol Yoo, WonChul Do, TaeKyeong Hwang, WonMyoung Ki, JaeHun Bae, InSu Mok, SeungMan Ryu
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a wafer-level compression molding process. The redistribution