Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Seung Man Kim"'
Autor:
Na Han, You Jeong Kim, Su Min Park, Seung Man Kim, Ji Suk Lee, Hye Sook Jung, Eun Ju Lee, Tae Kyoon Kim, Tae Nyun Kim, Min Jeong Kwon, Soon Hee Lee, Mi-kyung Kim, Byoung Doo Rhee, Jeong Hyun Park
Publikováno v:
Diabetes & Metabolism Journal, Vol 40, Iss 5, Pp 396-405 (2016)
BackgroundCognitive impairment and brain damage in diabetes is suggested to be associated with hypoglycemia. The mechanisms of hypoglycemia-induced neural death and apoptosis are not clear and reperfusion injury may be involved. Recent studies show t
Externí odkaz:
https://doaj.org/article/3b0a0035c9b14de9b59af21b753f0a70
Publikováno v:
The Journal of Internal Korean Medicine. 43:529-541
Objectives: Acanthopanax senticosus is a tree used in traditional medicine for various diseases. In this study, we investigated the anti-cancer effects of a water extract of Acanthopanax senticocus fruit (ASF) on 2 human breast cancer cell lines (MCF
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd7e62a38615cd9dae0370ef65349065
https://doi.org/10.22246/jikm.2022.43.4.529
https://doi.org/10.22246/jikm.2022.43.4.529
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf7eebe97ba235ee9becbdb0ce12c466
https://doi.org/10.1109/eptc56328.2022.10013199
https://doi.org/10.1109/eptc56328.2022.10013199
Autor:
Sumin Kang, Jae Hak Lee, Seung Man Kim, Jaeseung Lim, Ah-Young Park, Seongheum Han, Jun-Yeob Song, Seong-Il Kim
Thermo-mechanical analysis of monolithic microwave integrated circuit (MMIC) packaging is essential to guarantee the reliability of radio frequency/microwave applications. However, a method for fast and accurate analysis of MMIC packaging structures
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6cd6d8945f18e902b5743bb710b5edab
https://doi.org/10.21203/rs.3.rs-1931145/v1
https://doi.org/10.21203/rs.3.rs-1931145/v1
Publikováno v:
Journal of the Korean Society of Manufacturing Technology Engineers. 26:623-631
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d22445ed619ee347bb2c3dcabc63a10
https://doi.org/10.7735/ksmte.2017.26.6.623
https://doi.org/10.7735/ksmte.2017.26.6.623
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this study, polymer elastic bump (PEB) bonding process is suggested newly, which could reduce stressconcentration remarkably near bump and chip face by soft polymer bump material with electro-conductive metal line pattern and usage of non-conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b78029b60962a11ac51ae8c5a555d4a0
https://doi.org/10.23919/empc44848.2019.8951829
https://doi.org/10.23919/empc44848.2019.8951829
Autor:
Seung Man Kim, Soon Hee Lee, Mi-Kyung Kim, You Jeong Kim, Tae Kyoon Kim, Ji Suk Lee, Jeong Hyun Park, Tae Nyun Kim, Su Min Park, Eun Ju Lee, Min Jeong Kwon, Byoung Doo Rhee, Na Han, Hye Sook Jung
Publikováno v:
Diabetes & Metabolism Journal
Diabetes & Metabolism Journal, Vol 40, Iss 5, Pp 396-405 (2016)
Diabetes & Metabolism Journal, Vol 40, Iss 5, Pp 396-405 (2016)
BACKGROUND Cognitive impairment and brain damage in diabetes is suggested to be associated with hypoglycemia. The mechanisms of hypoglycemia-induced neural death and apoptosis are not clear and reperfusion injury may be involved. Recent studies show
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::456c26cfa56a138df15b26afa17c05a5
http://europepmc.org/articles/PMC5069396
http://europepmc.org/articles/PMC5069396
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Organic based materials and devices for flexible electronics are recognized as a promising field and application while they also have significant disadvantages such as low charge transport, process temperature limitation, and etc. Those limitations,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5fc8961f0e2a8266d38ee79df1a50cd
https://doi.org/10.1109/estc.2018.8546354
https://doi.org/10.1109/estc.2018.8546354
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
The hybrid thin film is fabricated by using polyimide (PI) and Polydimethylsiloxane (PDMS) to take combined advantages of their transparency, thermal stability and stretchability. Furthermore, another importance of such subtract is superhydrophobicit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20c036e728a614b26d446a277c16c8f5
https://doi.org/10.1109/estc.2018.8546473
https://doi.org/10.1109/estc.2018.8546473
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
System in Foil (SiF) package could realize flexible, multi-functional and higher performance package using flexible substrate and ultra-thin heterogeneous chip integration. In this study, PEB(polymer elastic bump) bonding process is suggested newly,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7512af2ed8b55198268b0e5ec7ac6003
https://doi.org/10.1109/estc.2018.8546418
https://doi.org/10.1109/estc.2018.8546418