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Autor:
Won Ji Park, Jae Hee Oh, Ji Hyung Kim, Seong Wook Moon, Jeong Hoon Ahn, Ding Shaofeng, Jung Ho Park, Won Hyoung Lee, Min Guk Kang, Choi Yun Ki, Seung Ki Nam, Je Gwan Hwang, Jong Mil Youn
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
Interposer to interconnect between the electronic components has been developed for the last few decades because it can improve the system performance effectively, compared to the system with intra-chip wiring. In this paper, the integrated stack cap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::342c132f1ebe9f90373a841699094d8f
https://doi.org/10.1109/iitc51362.2021.9537342
https://doi.org/10.1109/iitc51362.2021.9537342
