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pro vyhledávání: '"Seung H. Chae"'
Publikováno v:
Journal of Electronic Materials. 47:855-865
This paper reports experimental observations evidencing that the intermetallic compound phase interfaced with Cu in the Al-Cu diffusion couple is most likely α2-Cu3Al phase, not γ-Cu9Al4 phase as previously assumed, and that its growth to a critica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a230f02f2d6d0225c18364456115cd9
https://doi.org/10.1007/s11664-017-5877-y
https://doi.org/10.1007/s11664-017-5877-y
