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Autor:
S. Yagnamurthy, Shaw Fong Wong, Haowen Liu, Steven A. Klein, Haehn Nicholas S, Pramod Malatkar, Shankar Devasenathipathy, Tannaz Harirchian, Chia-Pin Chiu, Seth B. Reynolds
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Semiconductor packages undergo mechanical loading at various stages of the manufacturing, assembly and test process. Also, during the assembly of the thermal enabling solution in a system environment, mechanical loads are applied to ensure contact of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::767c8d05dbbcf0a02eca0cf2d2255ae0
https://doi.org/10.1109/ectc.2016.328
https://doi.org/10.1109/ectc.2016.328
