Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Serpil Kocabiyik"'
Publikováno v:
Journal of Thermophysics and Heat Transfer. 34:322-330
In the microelectronics industry, heat sinks are used for cooling microelectronic devices by transferring the heat generated by the device into an ambient fluid. In most applications, the heat conv...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2b811461d272ae2e10fdd6a6ee75594
https://doi.org/10.2514/1.t5904
https://doi.org/10.2514/1.t5904
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1526-1534
In this paper, approximate analytical solutions for the thermal resistance in cylindrical-shaped flux tubes with variable heat flux distributions and nonuniform heat transfer coefficients are obtained. The solutions are presented based on the method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4cfc21e3b09cc6c8f47c8169335c3dd
https://doi.org/10.1109/tcpmt.2019.2910132
https://doi.org/10.1109/tcpmt.2019.2910132
Publikováno v:
Journal of Thermophysics and Heat Transfer. 33:23-31
When the thermal conductivity of a material varies with temperature, the governing heat conduction equation becomes nonlinear and the use of constant thermal conductivity may produce unreliable res...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54182f9338bc1f28c62fe84c7a99b244
https://doi.org/10.2514/1.t5418
https://doi.org/10.2514/1.t5418
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:830-839
Heat sinks are designed in different types and shapes depending on temperature distribution along the sink plane, where sometimes intense cooling is only required in the high-temperature regions. Thus, a nonuniform heat transfer coefficient might be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::798c744bdc1babe9f77167d824df0f80
https://doi.org/10.1109/tcpmt.2017.2776601
https://doi.org/10.1109/tcpmt.2017.2776601
Publikováno v:
Journal of Thermophysics and Heat Transfer. 32:392-400
Anisotropic materials have received remarkable attention in the development of microelectronic devices. In many materials, the thermal conductivities are temperature-dependent and usually are appro...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3a987cdddc499208be56e9aa3a011b3
https://doi.org/10.2514/1.t5337
https://doi.org/10.2514/1.t5337
Publikováno v:
Heat Transfer Engineering. 39:946-956
An analytical approach for the thermal behavior of two dimensional rectangular flux channels with arbitrary boundary conditions on the source plane is presented. The boundary condition along the source plane can be a combination of the first kind bou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c98cde4ff864b99f493b6bb746c682ab
https://doi.org/10.1080/01457632.2017.1357747
https://doi.org/10.1080/01457632.2017.1357747
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In the microelectronic industry, thermal issues due to self-heating are major problems that affect the performance, efficiency, and reliability of devices. The recent trend of producing advanced devices with smaller sizes, high power densities, and e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64857c25870cef60d986e839c21f9d01
https://doi.org/10.1109/itherm.2019.8757247
https://doi.org/10.1109/itherm.2019.8757247
Publikováno v:
Journal of Thermophysics and Heat Transfer. 30:863-879
Thermal spreading resistance problems have been studied by many different researchers over the past six decades. In this paper, the literature on thermal spreading resistance from the past 50 years is chronologically presented, and the last decade of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57cbca46ae33d8266e485ccd6acf00e1
https://doi.org/10.2514/1.t4801
https://doi.org/10.2514/1.t4801
Publikováno v:
Journal of Heat Transfer. 140
In the microelectronics industry, the multilayered structures are found extensively where the microelectronic device/system is manufactured as a compound system of different materials. Recently, a variety of new materials have emerged in the microele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7c2ddc637d571820f184a60c11480e9
https://doi.org/10.1115/1.4038712
https://doi.org/10.1115/1.4038712
Autor:
Canan Bozkaya, Serpil Kocabiyik
Publikováno v:
Journal of Fluids and Structures. 59:394-405
A two-dimensional free surface flow past a circular cylinder forced to perform streamwise oscillations in the presence of an oncoming uniform flow is investigated at a Reynolds number of R=200 and fixed displacement amplitude, A=0.13, for the forcing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8121aa81d8148ea08dcda96db9c372b8
https://doi.org/10.1016/j.jfluidstructs.2015.08.006
https://doi.org/10.1016/j.jfluidstructs.2015.08.006