Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Serine Soh Siew Boon"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::393ed4303161d9652056beaa192f6be4
https://doi.org/10.1109/eptc56328.2022.10013118
https://doi.org/10.1109/eptc56328.2022.10013118
Autor:
Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::471b582a3dddeb1183ae7161575a8a9e
https://doi.org/10.1109/eptc53413.2021.9663915
https://doi.org/10.1109/eptc53413.2021.9663915
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9cd9a779bd828ba01d753609f867bcf
https://doi.org/10.1109/eptc53413.2021.9663931
https://doi.org/10.1109/eptc53413.2021.9663931
Autor:
Serine Soh Siew Boon, Chai Tai Chong, Simon Lim Siak Boon, Sharon Lim Pei Shan, Hsiao Hsiang Yao, David Ho Soon Wee, Chong Ser Choong
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
This paper describes the process development of fan-out wafer level package (FO-WLP) package that uses mold encapsulation to form the antenna element. The FO-WLP package is designed with a target frequency of 60GHz for wireless local area network (WL
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c22bbfa921553a88085dbb988c916ec0
https://doi.org/10.1109/eptc.2018.8654415
https://doi.org/10.1109/eptc.2018.8654415
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Enhancement of developing effect with Tetramethylammonium hydroxide (TMAH) of different concentration beneficially enhances the contour effect of Photo-resist (PR) after development. Tetramethylammonium hydroxide (TMAH) of different concentration is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e951d1ebabe288d9e92e15cdd0142a4
https://doi.org/10.1109/eptc.2015.7412364
https://doi.org/10.1109/eptc.2015.7412364
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The effect of processing the photo-sensitive insulating material on different copper surface roughness could illustrate the effect on the adhesion of these materials with a variation in surface roughness. A correlation study was conducted with copper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa28b28874265886442be861dbe9deb3
https://doi.org/10.1109/eptc.2014.7028351
https://doi.org/10.1109/eptc.2014.7028351