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Autor:
Anton S. Voronin, Yurii V. Fadeev, Mstislav O. Makeev, Pavel A. Mikhalev, Alexey S. Osipkov, Alexander S. Provatorov, Dmitriy S. Ryzhenko, Gleb Y. Yurkov, Mikhail M. Simunin, Darina V. Karpova, Anna V. Lukyanenko, Dieter Kokh, Dashi D. Bainov, Igor A. Tambasov, Sergey V. Nedelin, Nikita A. Zolotovsky, Stanislav V. Khartov
Publikováno v:
Materials; Volume 15; Issue 4; Pages: 1449
Embedded copper mesh coatings with low sheet resistance and high transparency were formed using a low-cost Cu seed mesh obtained with a magnetron sputtering on a cracked template, and subsequent operations electroplating and embedding in a photocurab