Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Sergey Butylkov"'
Autor:
Dave Biegelsen, Eugene M. Chow, Sourobh Raychaudhuri, Yunda Wang, Bradley B. Rupp, Sergey Butylkov, Lara S. Crawford, Anne Plochowietz, Jeng Ping Lu
Publikováno v:
SID Symposium Digest of Technical Papers. 52:845-848
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c9b35e4091ea4c28a7ac230b93cd003
https://doi.org/10.1002/sdtp.14815
https://doi.org/10.1002/sdtp.14815
Autor:
Ping Mei, Anne Plochowietz, Matthew Shreve, Lara S. Crawford, Qian Wang, Sourobh Raychaudhuri, Yu Wang, Jeng Ping Lu, Bradley B. Rupp, Eugene M. Chow, Jamie Kalb, Sergey Butylkov, Siv Kor, Yunda Wang
Publikováno v:
SID Symposium Digest of Technical Papers. 50:349-352
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3a722eda3ecbeb1986d144fa9199834
https://doi.org/10.1002/sdtp.12928
https://doi.org/10.1002/sdtp.12928
Autor:
Yunda Wang, Jamie Kalb, Lara S. Crawford, Sourobh Raychaudhuri, Yu Wang, Bradley B. Rupp, Sergey Butylkov, Eugene M. Chow, Anne Plochowietz, Matthew Shreve, Jeng P. Lu, Qian Wang
Publikováno v:
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).
A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9810e59802616d3d119415d9e7c27db
https://doi.org/10.1109/transducers.2019.8808800
https://doi.org/10.1109/transducers.2019.8808800
Autor:
Sourobh Raychaudhuri, Sergey Butylkov, Bradley B. Rupp, JengPing Lu, Qian Wang, Eugene M. Chow, Yunda Wang, Yu Wang, Jamie Kalb, Anne Plochowietz, Matthew Shreve, Ping Mei, Lara S. Crawford
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A deterministic, directed, parallel electrostatic assembly and transfer process is being developed to arrange chips for electronics applications. Singulated chips 10 um - 200 um in size and initially in solution, are sorted, transported and oriented
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::403160a938b1c87adc43ad0d349bfbc7
https://doi.org/10.1109/ectc.2019.00203
https://doi.org/10.1109/ectc.2019.00203