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pro vyhledávání: '"Ser Bok Leng"'
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Flip Chip (FC) interconnects for 3D, 2.5D and wafer level packaging (WLP) are fast becoming a common package for high performance applications. One of key challenges identify in assembly lie in the fine pitch of FC interconnect to the substrate. This
Autor:
Chen, Haoyang, Tee, Tong Yan, Siew, Glen, Soh, Serine, Kang, In Soo, Kim, Jong Heon, Lee, Teck Kheng, Ser, Bok Leng, Ng, Hun Shen, Hoe, Germaine, Gao, Shan
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p631-635, 5p