Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Sepehr Soroushiani"'
Autor:
Akeeb Hassan, Sepehr Soroushiani, Abdulhameed Abdal, Sk Yeahia Been Sayeed, Wei-Chiang Lin, Markondeya Raj Pulugurtha
Publikováno v:
IEEE Open Journal of Nanotechnology, Vol 3, Pp 52-60 (2022)
Embedded-chip planar silver-elastomer interconnect technology is developed with flexible substrates and demonstrated for on-skin biophotonic sensor applications. This approach has several benefits and is also consistent with chip-thinning where the c
Externí odkaz:
https://doaj.org/article/b2381df992cf4f92af8c7aedb2bf197f
Autor:
Jose Montes, Sk Yeahia Been Sayeed, Pulugurtha Markondeya Raj, Jorge Riera Diaz, Sepehr Soroushiani, Huy Nguyen, Carolina Moncion
Publikováno v:
2021 IEEE 21st International Conference on Nanotechnology (NANO).
Flexible electrode arrays with low impedance are becoming critical to enhance single-neuron sensing with high sensitivity. Such electrodes should be scalable to micron dimensions and yet retain low impedance. The key to accomplish this is to achieve:
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5b5c8edb53d9815726d640fee7b791b
https://doi.org/10.1109/nano51122.2021.9514286
https://doi.org/10.1109/nano51122.2021.9514286
Autor:
Huy Nguyen, Wei-Chiang Lin, Carlos Riera Cercado, Christopher Bolig, Sk Yeahia Been Sayeed, Abdulhameed Abdal, Shubhendu Bhardwaj, Sepehr Soroushiani, Pulugurtha Markondeya Raj
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The objective of this paper is to demonstrate flex-embedded and surface-assembled photonic devices, inductive telemetry, and passive integration to form next-generation miniaturized biophotonic sensors. A hybrid combination of embedding and surface-a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::deca04227818a229023e80dff055c294
https://doi.org/10.1109/ectc32696.2021.00246
https://doi.org/10.1109/ectc32696.2021.00246
Autor:
Shubhendu Bhardwaj, Pulugurtha Markondeya Raj, Daniel Wilding, Sepehr Soroushiani, M. M. Monshi, John L. Volakis, Sk Yeahia Been Sayeed, Jose Solis Camara
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The goal of this research is to demonstrate areaarray remateable interconnects in 3D flex or rigid-flex packages. Remateability is achieved with clamped connections between two area-array interconnect terminations using compressible z-interconnects i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1468572b92ed4e4fd59b21ac2b5ff6ea
https://doi.org/10.1109/ectc32862.2020.00111
https://doi.org/10.1109/ectc32862.2020.00111