Zobrazeno 1 - 10 of 20 pro vyhledávání: '"Seonho Jeong"'
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Akademický článek
Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization
Autor: Seonho Jeong, Kyeongwoo Jeong, Jinuk Choi, Haedo Jeong
Publikováno v: Applied Sciences, Vol 11, Iss 4, p 1507 (2021)
Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically. The surface of t
Externí odkaz: https://doaj.org/article/e004d4e40f57481290633ec0dce5cd9d
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Planarization profile modeling using pad bulk deformation and real contact area analysis of macro-scale device pattern
Autor: Seonho Jeong, Jongmin Jeong, Yeongil Shin, Youngwook Park, Masashi Kabasawa, Hirokuni Hiyama, Katsuhide Watanabe, Hisanori Matsuo, Yutaka Wada, Haedo Jeong
Publikováno v: Japanese Journal of Applied Physics. 62:SH1003
In general, the shape of the polished pattern is not flat but has a rounded curved profile. Unlike micro-patterns that have similar scales to pad asperities, macro-patterns have a very large scale compared to asperities, so bulk deformation must also
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5eb1a2c84d30a5aaf8490d05d39446b1
https://doi.org/10.35848/1347-4065/acc9cd
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