Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Seongju Baek"'
Autor:
Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, Junghwan Bang, Tae-Ik Lee, Seung-Boo Jung, JungSoo Kim, Yong-Ho Ko
Publikováno v:
Materials, Vol 14, Iss 2, p 335 (2021)
The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based
Externí odkaz:
https://doaj.org/article/3f6a38a695fd4527babac2c9adcea6f7
Autor:
Jungsoo Kim, Seongju Baek, Seung-Boo Jung, Gyu-Won Jeong, Dong-Yurl Yu, Tae-Ik Lee, Junghwan Bang, Yong-Ho Ko
Publikováno v:
Materials
Volume 14
Issue 2
Materials, Vol 14, Iss 335, p 335 (2021)
Volume 14
Issue 2
Materials, Vol 14, Iss 335, p 335 (2021)
The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn&ndash
58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn&nda
58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn&nda
Autor:
Jeong, Gyuwon1,2 (AUTHOR) gyuwon@kitech.re.kr, Yu, Dong-Yurl1,3 (AUTHOR) alpha0987@kitech.re.kr, Baek, Seongju1,4 (AUTHOR) back9457@kitech.re.kr, Bang, Junghwan1 (AUTHOR) nova75@kitech.re.kr, Lee, Tae-Ik1 (AUTHOR) tilee@kitech.re.kr, Jung, Seung-Boo2 (AUTHOR), Kim, JungSoo1 (AUTHOR) kjs207@kitech.re.kr, Ko, Yong-Ho1,5 (AUTHOR) kjs207@kitech.re.kr
Publikováno v:
Materials (1996-1944). Jan2021, Vol. 14 Issue 2, p335-335. 1p.