Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Seonghui Han"'
Publikováno v:
Materials, Vol 17, Iss 14, p 3619 (2024)
In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques. Commercial SAC305 so
Externí odkaz:
https://doaj.org/article/68d99af805e447c19c87cf27aaf721f7
