Zobrazeno 1 - 10
of 58
pro vyhledávání: '"Seong Dae Park"'
Autor:
Jeongah Kim, Bo-Young Kim, Seong Dae Park, Ji-Hun Seo, Chan-Jae Lee, Myong Jae Yoo, Youngmin Kim
Publikováno v:
Micromachines, Vol 12, Iss 8, p 943 (2021)
Because electronics are becoming flexible, the demand for techniques to manufacture thin flexible printed circuit boards (FPCBs) has increased. Conventional FPCBs are fabricated by attaching a coverlay film (41 μm) onto copper patterns/polyimide (PI
Externí odkaz:
https://doaj.org/article/b3df14a5b4b2478b8394dda7ba31b878
Publikováno v:
Ceramics International. 48:1408-1414
Hexagonal boron nitrides (h-BNs) have received much attention as thermally conductive fillers because of their high thermal conductivity. However, their high aspect ratio hampers the realization of high filler loading by dramatically increasing visco
Autor:
Bo-Young Kim, Hyunseung Yang, Myong Jae Yoo, Seong-Dae Park, Woo Sung Lee, Gwajeong Jeong, Chan Ho Park, Daegon Lee
Publikováno v:
ACS Applied Polymer Materials. 3:4735-4745
Autor:
Bo-Young Kim, Chan Ho Park, Hyunseung Yang, Woo Sung Lee, Seong-Dae Park, Gwajeong Jeong, Jeongah Kim
Publikováno v:
ACS Applied Polymer Materials. 2:5228-5237
To realize a wide range of applications using three-dimensional (3D) printing, it is urgent to develop 3D printing resins with exceptional features such as enhanced mechanical properties. Herein, w...
Publikováno v:
Nuclear Engineering and Design. 399:111997
Publikováno v:
Functional Composites and Structures. 4:045008
There has been a growing interest in developing carbon-based polymer composites for electromagnetic interference (EMI) shielding materials. To achieve a high EMI shielding performance, the morphology of fillers in composites must be controlled. Altho
Autor:
Myong Jae Yoo, Chan-Jae Lee, Jeongah Kim, Youngmin Kim, Seong Dae Park, Bo-Young Kim, Ji Hun Seo
Publikováno v:
Micromachines
Volume 12
Issue 8
Micromachines, Vol 12, Iss 943, p 943 (2021)
Volume 12
Issue 8
Micromachines, Vol 12, Iss 943, p 943 (2021)
Because electronics are becoming flexible, the demand for techniques to manufacture thin flexible printed circuit boards (FPCBs) has increased. Conventional FPCBs are fabricated by attaching a coverlay film (41 μm) onto copper patterns/polyimide (PI
Publikováno v:
Surface and Coatings Technology. 372:134-139
Fabrication of hydrophobic surface with exceptional mechanical robustness has been of considerable interest for its urgent practical application. Herein, we demonstrate a facile approach to fabricate mechanically robust, hydrophobic surface by combin
We experienced a unilateral alveolar hemorrhage associated with negative pressure pulmonary edema that occurred after long history of asthma patient bit the endotracheal tube during posture change at the end of surgery. We describe herein perioperati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e681b17160a7b67578ad6e6e2f94ad3
https://doi.org/10.22541/au.160071234.45067807
https://doi.org/10.22541/au.160071234.45067807
Autor:
Ji-Hyun Choi, Soon Chang Park, Hyung Gon Jin, Suk Kwon Kim, Dong Won Lee, Young-Bum Chun, Dong Jun Kim, Chang Shuk Kim, Seungyon Cho, Eo Hwak Lee, Kihak Im, Jae Sung Yoon, Cheol Woo Lee, Mu-Young Ahn, Seong Dae Park, Yi-Hyun Park, Duck Young Ku, Young-Min Lee
Publikováno v:
Fusion Engineering and Design. 136:190-198
Korea has own programs toward DEMO and fusion reactors that will require further improved DEMO blanket and energy utilization systems. Primary goals of DEMO blanket development in Korea are to develop and verify the integrated blanket design tools; t