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pro vyhledávání: '"Seogyoung Yoon"'
Publikováno v:
Heliyon, Vol 10, Iss 5, Pp e27580- (2024)
Although epoxy-based composites that consist of inorganic fillers and matrixes are widely used in “conventional” electronic packaging applications due to their excellent insulation and robust properties, they limit their uses in “advanced elect
Externí odkaz:
https://doaj.org/article/4457b9e8b27d4aac8359522fc1e256d4
Publikováno v:
Composites Science and Technology. 224:109456
Publikováno v:
2008 3rd IEEE International Conference on Nano/Micro Engineered & Molecular Systems; 2008, p1024-1027, 4p