Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Seiji Shika"'
Autor:
Tsuyoshi Kida, Katsuhiko Shimura, Shu Yoshida, Suzuki Takuya, Seiji Shika, Katagiri Shunsuke, Kumazawa Yune
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
2.1D package is expected to lead the progresses of technology drivers such as 5G communications and AI (Artificial Intelligence), however, the organic interposers for 2.1D still have technological challenges in fine patterning. In this work, the nove
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3906dfc11b019c584f72c56d01a39c21
https://doi.org/10.1109/ectc32862.2020.00149
https://doi.org/10.1109/ectc32862.2020.00149
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Photo-sensitive dielectric materials applicable to advanced organic interposers are desired to realize cost-effective semiconductor packages equipped with fine patterning capability. In this work, the novel photo-polymerizable compound expected to be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ee583ce07074a713b2c0cb2dfa2dfbc
https://doi.org/10.1109/ectc.2019.00158
https://doi.org/10.1109/ectc.2019.00158