Zobrazeno 1 - 10
of 91
pro vyhledávání: '"Seiji Kaneko"'
Publikováno v:
Japanese Journal of Infection Prevention and Control. 31:158-164
Publikováno v:
山梨学院短期大学研究紀要. 31:1-6
Autor:
Akihiko, Hirai, Seiji, Kaneko, Akiko, Nakama, Naoto, Ishizaki, Megumi, Odagiri, Akemi, Kai, Kenji, Sadamasu, Takayuki, Shinkai, Kazuyoshi, Yano, Satoshi, Morozumi
Publikováno v:
Journal of the Food Hygienic Society of Japan (Shokuhin Eiseigaku Zasshi). 46:86-92
A total of 244 milk samples collected from supermarkets in Tokyo were examined for contamination with Coxiella burnetii. C. burnetii DNA was detected in 131 (53.7%) of the samples by nested PCR. PCR-positive samples were injected into immunosuppresse
Autor:
Tokuhiro Nishina, Seiji Kaneko, Kohkichi Gotoh, Takashi Masuda, Hirotaka Konuma, Akinobu Saito, Junko Hasegawa, Michiko Miyahara
Publikováno v:
Japanese Journal of Food Microbiology. 21:23-29
最近野菜に関わる2次汚染による食中毒事件発生が多い.この発生防止策を考えるための知見を得る目的で, 腸管出血性大腸菌O157 (O157) と2種サルモネラ [Salmonella Infantis (SI) とSalmonella Enteritid
Publikováno v:
Japanese Journal of Food Microbiology. 17:189-193
Publikováno v:
Japanese Journal of Food Microbiology. 17:235-243
Study on Preparation of Uniform Volume Particles using Ultrasonic-wave as Shape-controlled Materials
Publikováno v:
Shigen-to-Sozai. 115:111-116
The production method for uniform droplets has been investigated usingultrasonic-wave. The ultrasonic-wave was loaded to the fluid, which was fed by a double plunger pump and was spouted out from the nozzle. This studywas attempted that the uniform d
Publikováno v:
Ultrasonics. 36:75-78
It is well known that the temperature for plastic welding is higher than the glass transition temperature (Tg) in order to make the plastic soften and melt. However, we found the conditions under which some engineering plastics, such as polyamide66,
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 64:550-557
Stress-strain analyses for Sn-Pb cutectic solder joints in a thin single outline package (STOP), a ball grid array (BGA) assembly, and a leadless ceramic chip carrier (LCCC) were carried out for investigation of plastic-creep behavior, and of stress
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 64:558-563
An isothermal mechanical fatigue test method and fatigue testing equipment were developed to investigate the low cycle fatigue strength of Sn-Pb eutectic solder joints. Based upon the results of finite element analysis, it is found that the rate of i