Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Seiichirou Takahashi"'
Autor:
Junji Kawakubo, Masakazu Yoshioka, Shintaro Wagashima, Takuya Nishino, Masaharu Morita, Seiichirou Takahashi, Hirokazu Yamade
Publikováno v:
Rigakuryoho kagaku. 31:183-188
Autor:
Koichi Hasegawa, Shiro Kusumoto, Toyohiro Aoki, Kenzo Ohkita, Takashi Hisada, Hiroyuki Mori, Seiichirou Takahashi, Yasumitsu Orii, Eiji Nakamura, Jun Mukawa, Chihiro Kobata
Publikováno v:
Journal of Photopolymer Science and Technology. 29:395-402
Autor:
Toyohiro Aoki, Kazushige Toriyama, Akira Takaguchi, Yasumitsu Orii, Takashi Nauchi, Seiichirou Takahashi, Jun Mukawa, Koichi Hasegawa, Hiroyuki Mori, Hideki Nakamura
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 18:443-448
Autor:
Jae-Woong Nah, Katsumi Inomata, Toyohiro Aoki, Kazushige Toriyama, Seiichirou Takahashi, Hiroyuki Mori, Yasumitsu Orii, Shiro Kusumoto, Jun Mukawa, Kouichi Hasegawa
Publikováno v:
International Symposium on Microelectronics. 2014:000713-000717
IMS (injection molded solder) is an advanced solder bumping technology with solder alloy flexibility even at very fine pitch and small size. One of key materials for successful fine pitch bumping by IMS is a photoresist material. The photoresist mate
Autor:
Kenzou Ohkita, Toyohiro Aoki, Yasuharu Yamada, Yasumitsu Orii, Koichi Hasegawa, Eiji Nakamura, Jun Mukawa, Hiroyuki Mori, Takashi Hisada, Seiichirou Takahashi, Chihiro Kobata
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Fine pitch interconnect is one of key technology elements for 2.5D and 3D IC. Low cost and flexibility in technical aspects are also important, so that the technology can be used for wide range of applications. We have newly developed a non-strip typ
Autor:
Toyohiro Aoki, Hiroyuki Mori, Kenzo Ohkita, Eiji Nakamura, Jun Mukawa, Yasumitsu Orii, Koichi Hasegawa, Takashi Hisada, Chihiro Kobata, Seiichirou Takahashi, Shiro Kusumoto
Publikováno v:
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
Novel bumping technology that can realize high density assembly of IC chips and packages with a high number of I/O is required in the field of electronic packaging. Currently, the electroplating method or the solder ball placement method have been wi
Publikováno v:
Rigakuryoho Kagaku. 27:529-533
Autor:
Takayoshi Ito, Minil Kim, Hiroyuki Miki, Masayuki Nakano, Seiichirou Takahashi, Michio Imawari
Publikováno v:
Kanzo. 46:406-413
症例は50歳女性. 肝機能障害のため当院受診し, 自己免疫性肝炎重症化の診断でメチルプレドニゾロン大量療法を開始した. 肝障害は軽快したためステロイドを漸減, プレドニゾロンへ変更
Autor:
Nobuo Itou, Kenji Torazawa, Akiomi Kunisa, Seiichirou Takahashi, Yoshihisa Suzuki, Kenji Asano, Murata Seiji, Noboru Mamiya
Publikováno v:
Joint International Symposium on Optical Memory and Optical Data Storage.
We have developed a video disk recorder system using a magnetically induced super resolution (MSR) magneto-optical (MO) disk 120 mm in diameter and achieved a user data capacity of 4.1 Gbytes per disk using land/groove recording technology, a laser w
Publikováno v:
Rigakuryoho Kagaku; 2012, Vol. 27 Issue 5, p529-533, 5p