Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Seiichi Okoda"'
Publikováno v:
Microelectronics Reliability. 55:1363-1368
We developed a high-throughput screening tester for DBC-module of IGBT. The tester realizes a new screening test with current distribution in addition to a conventional switching test. It consists of a power circuit, a replaceable test head, sensor a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4843be38afb6f5ff09b1745d79678b2a
https://doi.org/10.1016/j.microrel.2015.06.016
https://doi.org/10.1016/j.microrel.2015.06.016
Publikováno v:
Microelectronics Reliability. 55:1357-1362
Current crowding of IGBT and power diode in a chip or among chips is a barrier to the realization of highly-reliable power module and power electronics system. Current crowding occurs because of the parasitic inductance, difference of chip characteri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f3cea1be5572483b1a9a82f04993a15
https://doi.org/10.1016/j.microrel.2015.06.045
https://doi.org/10.1016/j.microrel.2015.06.045