Zobrazeno 1 - 10
of 762
pro vyhledávání: '"Seidel, Robert"'
Publikováno v:
AMC 2015 – Advanced Metallization Conference
Integration of dielectrics with increased porosity is required to reduce the capacitance of interconnects. However, the conventional dual damascene integration approach is causing negative effects to these materials avoiding their immediate implement
Autor:
Calvo, Jesús, Steinke, Philipp, Wislicenus, Marcus, Gerlich, Lukas, Seidel, Robert, Clauss, Ellen, Uhlig, Benjamin
Publikováno v:
AMC 2015 – Advanced Metallization Conference
Plasma induced damage of ultra low-k (ULK) dielectrics is a common phenomenon in BEOL interconnects. The damage leads to an increase in k-value, which raises the RC delay, leading to increased power consumption and cross talk noise. Therefore, divers
Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment
Autor:
Calvo, Jesús, Steinke, Philipp, Wislicenus, Marcus, Gerlich, Lukas, Seidel, Robert, Clauss, Ellen, Uhlig, Benjamin
Publikováno v:
AMC 2015 – Advanced Metallization Conference
Plasma induced damage of ultra low-k (ULK) dielectrics is a common phenomenon in BEOL interconnects. The damage leads to an increase in k-value, which raises the RC delay, leading to increased power consumption and cross talk noise. Therefore, divers
This paper investigates total variation minimization in one spatial dimension for the recovery of gradient-sparse signals from undersampled Gaussian measurements. Recently established bounds for the required sampling rate state that uniform recovery
Externí odkaz:
http://arxiv.org/abs/2009.03694
Publikováno v:
Inf. Inference 11.1 (2022), 203-250
This paper investigates total variation minimization in one spatial dimension for the recovery of gradient-sparse signals from undersampled Gaussian measurements. Recently established bounds for the required sampling rate state that uniform recovery
Externí odkaz:
http://arxiv.org/abs/2001.09952
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