Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Sei Umisedo"'
Autor:
Kohei Tanaka, Sei Umisedo, Hideyasu Une, Sami K. Hahto, Yusuke Kuwata, Karuppanan Sekar, Yoshiki Nakashima, Masayoshi Hino, Hirofumi Asai, Thormas N. Horsky, Tetsuya Igo, Tetsuro Yamamoto, Nariaki Hamamoto
Publikováno v:
2016 21st International Conference on Ion Implantation Technology (IIT).
A new high current Ion implanter "LUXiON" has been developed. Superior high beam current and high beam controllability are achieved by a novel beam transportation system, which extracts a high current long ion beam from an ion source, then transports
Autor:
Masayasu Tanjyo, Nobuo Nagai, Yuji Koga, Sei Umisedo, Tsutomu Nagayama, T. Matsumoto, Nariaki Hamamoto, Noriaki Maehara, John Borland, Hideyasu Une
Publikováno v:
ECS Transactions. 18:1059-1064
Newly developed sweep beam Cluster ion implanter: CLARIS with 0.2-7keV energy range for Boron beam and 1-10keV energy range for Carbon beam is introduced. Novel Cluster ion implantation technology is capable for 45nm beyond device requiring USJ forma
Autor:
Shigeki Sakai, Sei Umisedo, Yasuo Nara, Nobuo Nagai, Masayasu Tanjyo, Takayuki Aoyama, Tsutomu Nagayama, Nariaki Hamamoto
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 237:443-448
A decaborane implantation system has been developed. The maximum beam current achieved at a wafer is 30 μA at 5 keV with the divergence less than 0.4°, which corresponds to the equivalent 500 eV–300 μA boron monomer implantation without an energ
Autor:
Shigeki Sakai, Seigo Kanemaru, Tsuyoshi Kojima, T. Ikejiri, Junzo Ishikawa, Sei Umisedo, Hiroshi Tsuji, Nobuo Nagai, Yasuhito Gotoh, Masayoshi Nagao, K. Nakamura
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 237:390-394
We propose use of silicon field emission array as a novel charge neutralization device for ion implanter. Fundamental characteristics of the emitted electrons, i.e. energy distribution and operation in high vacuum were investigated. As a result, ener
Autor:
Junzo Ishikawa, Kouji Nakamura, Sei Umisedo, Toshihiko Kojima, Nobuo Nagai, Hiroshi Tsuji, Shigeki Sakai, Yasuhito Gotoh, Tadashi Ikejiri
Publikováno v:
Shinku. 48:329-332
We propose the application of silicon field emitter array (Si-FEA) to resolve the problem of wafer charging in the ion implantation process. This article reports experiments conducted to review the basic property of Si-FEA. This time, we measured the
Publikováno v:
The Review of scientific instruments. 85(2)
Ion sources for ion implantation are introduced. The technique is applied not only to large scale integration (LSI) devices but also to flat panel display. For LSI fabrication, ion source scheduled maintenance cycle is most important. For CMOS image
Autor:
Yoshiki Nakashima, Yuji Koga, Hiroshi Onoda, Masahiro Hashimoto, Nariaki Hamamoto, Sei Umisedo, Tsutomu Nagayama
Publikováno v:
2012 12th International Workshop on Junction Technology.
Low temperature cluster carbon co-implantation was applied for phosphorous activation enhancement and transient enhanced diffusion (TED) suppression. The dependence of phosphorous activation and TED on 1) carbon energy, 2) dose and 3) substrate tempe
Autor:
Tsutomu Nagayama, Hiroshi Onoda, Nariaki Hamamoto, Sei Umisedo, Yasunori Kawamura, Yoshiki Nakashima, Yuji Koga, Masahiro Hashimoto
Publikováno v:
AIP Conference Proceedings.
Carbon co-implantation is well known as an effective method for suppressing boron/phosphorous transient enhanced diffusion (TED). Germanium pre-amorphization implantation (PAI) is usually applied prior to carbon co-implantation for suppressing channe
Autor:
Sei Umisedo, Tsutomu Nagayama, Nariaki Hamamoto, Hiroshi Onoda, Masahiro Hashimoto, Yuji Koga, Yoshiki Nakashima, Yasunori Kawamura
Publikováno v:
AIP Conference Proceedings.
Amorphous Si layer formation with cluster carbon ion implantations at low substrate temperature and its effects on damage recovery and diffusion suppression have been discussed. Cluster carbon molecule species (C3Hx∼C7Hx), implantation temperature
Autor:
Jason Reyes, Kouhei Tanaka, Nariaki Hamamoto, Noriaki Maehara, Hiroshi Onoda, Yuji Koga, Yoshiki Nakashima, Shinichi Sezaki, Tsutomu Nagayama, S. Prussin, Yasunori Kawamura, Yoshikazu Hashino, Shigeki Sakai, Hideki Yoshimi, Masayasu Tanjyo, Masahiro Hashimoto, Sei Umisedo
Publikováno v:
2010 18th International Conference on Advanced Thermal Processing of Semiconductors (RTP).
Cluster C implantation at low temperature has been studied in terms of amorphous Si (a-Si) formation and elimination of B implanted induced end of range defects (EORDs). Thickness of a-Si can be controlled by C equivalent energy and dose. Monomer C n