Zobrazeno 1 - 10
of 54
pro vyhledávání: '"Sedig Agili"'
Autor:
Aldo Morales, Sedig Agili
Publikováno v:
Ingeniare: Revista Chilena de Ingeniería, Vol 17, Iss 1, Pp 4-5 (2009)
Externí odkaz:
https://doaj.org/article/d7b5e8511b1b49cd8dcc0eae72496fec
Publikováno v:
Journal of Research in STEM Education. 7:1-20
This article highlights a customized mentoring program that successfully supported underrepresented students in science, technology, engineering, and mathematics (STEM) disciplines at a university in the northeastern part of the United States (U.S.).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54c60cc07f0b952eaf57541764db4ca4
https://doi.org/10.51355/jstem.2021.94
https://doi.org/10.51355/jstem.2021.94
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 70:1-13
S-parameter characterization of high-speed interconnect components is prone to numerical, modeling, and/or measurement error due, in part, to the sampled nature of the data. This is a problem in modern package design where extensive signal integrity
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4a06388461fe10b7ad987f18eeb7ecb
https://doi.org/10.1109/tim.2020.3022440
https://doi.org/10.1109/tim.2020.3022440
Publikováno v:
2022 IEEE International Conference on Consumer Electronics (ICCE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ff9746e227875f7a72da25aa2240b50
https://doi.org/10.1109/icce53296.2022.9730466
https://doi.org/10.1109/icce53296.2022.9730466
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 68:4419-4426
The plastic materials form an important constituent of connectors and printed circuit board substrates. At high data transmission rates in interconnect devices, knowledge of the plastic’s performance, such as its dielectric properties is an imperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59b455cb7c5e151c0506b1cac24d4891
https://doi.org/10.1109/tim.2018.2889361
https://doi.org/10.1109/tim.2018.2889361
Publikováno v:
Microwave and Optical Technology Letters. 62:675-682
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07e3faee3bcb9691b7c4a56389338d41
https://doi.org/10.1002/mop.32098
https://doi.org/10.1002/mop.32098
Publikováno v:
2004 Annual Conference Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb7ca99208eb11f73a6b2658802d8a9f
https://doi.org/10.18260/1-2--12862
https://doi.org/10.18260/1-2--12862
Publikováno v:
2005 Annual Conference Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ff513d772552f963179642a65fe6301
https://doi.org/10.18260/1-2--14322
https://doi.org/10.18260/1-2--14322
Autor:
Aloysius Emig Jr., Sedig Agili
Publikováno v:
2006 Annual Conference & Exposition Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09b7fa08bf52d6fcb4c2969f69dff2b5
https://doi.org/10.18260/1-2--1353
https://doi.org/10.18260/1-2--1353
Publikováno v:
ICCE
The Non-Metallic Connector (NMC) was introduced several years ago. In this new iteration, the NMC has been redesigned to accomplish data transfer with an optical interface and wireless power transfer with the use of micro-inductors. To demonstrate th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5e1b0bee820315a8520dc52f7bf9bf7
https://doi.org/10.1109/icce46568.2020.9042993
https://doi.org/10.1109/icce46568.2020.9042993