Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sebnem Ozbek"'
Publikováno v:
ECS Meeting Abstracts. :812-812
Highly elastic solutions have been shown to increase particulate removal from silicon wafers, indicating the possibility for reduced reliance upon hazardous chemicals and expensive technologies during post-CMP cleaning processes. We explored the onse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::256f270ed8853035731f85945bcb6a84
https://doi.org/10.1149/ma2021-0120812mtgabs
https://doi.org/10.1149/ma2021-0120812mtgabs
Publikováno v:
ECS Meeting Abstracts. :1039-1039
The chemical and mechanical actions of the CMP process to achieve planarization and material removal also affect the defectivity and post cleaning requirements spontaneously. The wafer surface is cleaned from the excessive chemicals and the slurry pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7540903f956a72c3aa47967fe897e2aa
https://doi.org/10.1149/ma2019-01/17/1039
https://doi.org/10.1149/ma2019-01/17/1039
Publikováno v:
ECS Meeting Abstracts; 2021, Vol. MA2021-01 Issue 1, p812-812, 1p