Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Sebastien Mermoz"'
Autor:
Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Emeline Souchier, Emilie Deloffre, Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke, Victor Gredy, Patrick Lamontagne, Olivier Thomas, Helene Fremont
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a42f50d1b2b2ec4d3e00f1ba77cb1dba
https://doi.org/10.1109/eptc56328.2022.10013180
https://doi.org/10.1109/eptc56328.2022.10013180
Autor:
Yann Henrion, Sandrine Lhostis, Stephane Moreau, Daniel Scevola, V. Balan, Francois Guyader, Carine Besset, David Bouchu, Anne-Lise Le Berrigo, E. Deloffre, A. Jouve, Julien Pruvost, Sebastien Mermoz
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper presents, for the first time, an electromigration study for a hybrid bonding-based integration for advanced image sensor applications. This work demonstrates that the hybrid bonding module has no impact on the electromigration resistance o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa087c1878e6f6f7fe0a5107ac309479
https://doi.org/10.1109/ectc.2016.27
https://doi.org/10.1109/ectc.2016.27
Autor:
Deloffre, Emilie, Ayoub, Bassel, Lhostis, Sandrine, Dettoni, Florent, Fournel, Frank, Montméat, Pierre, Mermoz, Sebastien
Publikováno v:
ECS Meeting Abstracts; 2023, Vol. MA2023-02 Issue 1, p1592-1592, 1p
Publikováno v:
Handbook of 3D Integration (9783527334667); 2014, p295-312, 18p
Publikováno v:
Handbook of 3D Integration (9783527334667); 2014, pI-XXII, 22p
Autor:
Lee, K.W., Nagai, C., Nakamura, A., Aizawa, H., Bea, J.C., Koyanagi, M., Hashiguchi, H., Fukushima, T., Tanaka, T.
Publikováno v:
2015 International 3D Systems Integration Conference (3DIC); 2015, pTS1.2.1-TS1.2.4, 0p
Autor:
BROWAEYS CHRISTINE
• Monde de la matière et monde digital, où en sommes-nous aujourd'hui? Comment appréhender la matière dans un monde de plus en plus virtuel? • L'objectif de l'ouvrage est de réexaminer le rapport à la matérialité, car il permet de compren
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bond