Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Sebastiano Brida"'
Publikováno v:
Proceedings, Vol 1, Iss 4, p 607 (2017)
This paper presents the study of gold/gold thermocompression bonding at silicon wafer level. The first samples contains sealing rings and electrical pads, and are characterized on pull, and shear test showing bond strength similar to silicon/glass an
Externí odkaz:
https://doaj.org/article/9d249173738d4b04bc41c6f867c86f5f
Autor:
M. Ignat, Cedric Seguineau, Charles Josserond, C. Malhaire, Sebastiano Brida, Laurent Debove, Xavier Lafontan, Jean-Michel Desmarres
Publikováno v:
Review of Scientific Instruments
Review of Scientific Instruments, American Institute of Physics, 2009, 80 (2), pp.023901 1-5. ⟨10.1063/1.3077153⟩
Review of Scientific Instruments, American Institute of Physics, 2009, 80 (2), pp.023901 1-5. ⟨10.1063/1.3077153⟩
International audience; This paper describes a microtensile test system and the design as the realization of the samples dedicated to the tensile experiments. Two different technologies for the development of miniaturized specimens are detailed: self
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2a5ab4c4586584d8c09d2d5863c43296
https://hal.archives-ouvertes.fr/hal-00437164
https://hal.archives-ouvertes.fr/hal-00437164
Autor:
C. Malhaire, Sabine Lay, Francine Roussel d'Herbey, Cedric Seguineau, Jean Michel Desmarres, Xavier Lafontan, Michel T. Ignat, Sebastiano Brida
Publikováno v:
MRS Proceedings
MRS Proceedings, 2008, 1139
MRS Proceedings, 2008, 1139
The results of micromechanical tensile experiments performed on thin aluminum samples are presented and discussed. The micro tensile test system and the design of the samples, based on finite element modeling (FEM), and their production by micromachi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8fc92d286abdd43db8122bd1c4640f8b
https://doi.org/10.1557/proc-1139-gg04-04
https://doi.org/10.1557/proc-1139-gg04-04
Publikováno v:
MRS Proceedings. 854
The purpose of the present work was to study the long term stress stability of thin films used in harsh environment sensors. A stress determination method, based on cantilevers curvatures measurements, checked by means of 3D finite element simulation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0f0768a2c3f86476b7ee286c80b70eb
https://doi.org/10.1557/proc-854-u8.12
https://doi.org/10.1557/proc-854-u8.12
Publikováno v:
SPIE Proceedings.
Tetramethyl ammonium hydroxide (TMAH) solutions have been used to realize IC-compatible micromachined structures and device isolation. THe very low etch rate of PECVD dielectric layers and the possibility to passivate the aluminum metalization by dop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e988e80a94a9087ff19ca62ebb85afe4
https://doi.org/10.1117/12.251213
https://doi.org/10.1117/12.251213
Conference
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