Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Sebastian Zarwell"'
Autor:
Tobias Bernhard, Stefan Kempa, Sebastian Zarwell, Edith Steinhäuser, R. Massey, Frank Branduuml
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:40-50
The effect of the Cu target pad roughness on the growth mode of electroless Cu from two different Cu baths was investigated, with bath A having a cyanide based, and bath B, a non-cyanide-based stabilizer system. Both baths are commonly used within th
Autor:
Delilah A. Brown, Sebastian Zarwell, Tobias Bernhard, Alex R. MacDonald, Eamon A. McCarron, Ralf Brüning
Publikováno v:
Journal of Applied Electrochemistry. 51:795-802
A cyanide-stabilized electroless copper plating process with nickel as a stress-regulating additive was investigated. Small amounts of nickel or cyanide increase the deposition rate, while large amounts of cyanide decrease the deposition rate. The st
Autor:
Tobias Bernhard, Tanu Sharma, Alexandre Leger, Alexandre E. Landry, Ralf Brüning, Delilah A. Brown, Frank Brüning, Sebastian Zarwell
Publikováno v:
Thin Solid Films. 666:76-84
Hydrogen co-deposition in electroless copper is a cause of embrittlement, voids and blisters. Hydrogen release in the plating bath and its incorporation into the copper films were measured. The amount of hydrogen in the films was determined by monito
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
The electrical reliability of multilayer High Density Interconnection Printed Circuit boards (HDI PCBs) is mainly affected by the thermo-mechanical stability of stacked micro via interconnections. In this regard, a critical failure mode is the stress
Autor:
Lutz Stamp, Julia Lehmann, Jan Knaup, Andre Beyer, Yvonne Welz, Sebastian Zarwell, Laurence J. Gregoriades, Stefan Kempa, Josef Gaida, Andreas Kirbs
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
A new activation process for electroless copper plating has been developed, which does not require the use of a palladium-based activation bath as typically employed in the plating industry. The activation bath of the new process described herein is
Autor:
E. R. Logan, Ning Chen, Tanu Sharma, Ralf Brüning, Edith Steinhäuser, Tobias Bernhard, Sebastian Zarwell, Frank Brüning
Publikováno v:
Thin Solid Films. 626:131-139
Plating rates and Ni co-deposition were measured for electroless Cu plating baths without and with an added proprietary stabilizer system. The bath has formaldehyde as reducing agent and tartrate as complexing agent. The concentrations of Ni and stab
Autor:
Tobias Bernhard, Kilian Klaeden, Jörg Schulze, Sebastian Zarwell, Ralf Brüning, Maryam Abbasi, Delilah A. Brown
Publikováno v:
Thin Solid Films. 714:138366
The production of highly flexible printed circuit boards requires copper plating on roll annealed (RA) Cu foils with strong (001) crystallographic orientation, with electroless copper plating followed by galvanic copper plating. Concurrent epitaxial
Publikováno v:
International Symposium on Microelectronics. 2015:000099-000104
Electroless deposition of thin Cu layers is one of the crucial steps during the manufacturing of printed circuit boards (PCBs). Electroless Cu serves as a conductive seed layer on nonconductive substrate material (epoxy, polyimide, glass, etc.) for t
Autor:
Tobias Bernhard, Frank Brüning, Ralf Brüning, Tanu Sharma, Delilah Brown, Sebastian Zarwell, Craig Bishop
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 12:86-91
Electroless Cu plating is a key process to provide electrically conductive layers on insulating substrates for the subsequent Cu electroplating of printed-circuit boards (PCBs). Recently introduced substrate materials are prone to spontaneous delamin
Autor:
Craig Bishop, Tanu Sharma, Tobias Bernhard, Sebastian Zarwell, Delilah A. Brown, Ralf Brüning, Frank Brüning
Publikováno v:
International Symposium on Microelectronics. 2014:000448-000452
Electroless copper plating is a key process to provide electrically conductive layers on insulating substrates for the subsequent copper electroplating of printed circuit boards (PCBs). Recently introduced substrate materials are prone to spontaneous