Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Sebastian Lungen"'
Autor:
Klaus-Jurgen Wolter, Karlheinz Bock, Tobias Tiedje, Sebastian Lungen, Lukas Lorenz, Krzysztof Nieweglowski
Publikováno v:
Microelectronics Reliability. 84:121-126
This contribution discusses technology development for the realization of chip-to-chip interconnection based on flexible optical waveguides. Two approaches for optical coupling between waveguides and active devices are presented. Both approaches buil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e72b7122867586e4769384010145146
https://doi.org/10.1016/j.microrel.2018.03.020
https://doi.org/10.1016/j.microrel.2018.03.020
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
3D integration and additive technologies are an emerging field in electronic packaging, which becomes more and more established. A new technology approach is presented, aiming to build the package around the components. The components are embedded in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9498672f8120bbe96ec3749f7f93878b
https://doi.org/10.1109/estc.2018.8546417
https://doi.org/10.1109/estc.2018.8546417
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
The main challenge in 3D-additive packaging is the manufacturing of the conductive redistribution layer. In most state-of-the-art and recent research, conductive polymer and nanoparticle sinter inks are used to print the conductive layers. However, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51237e8f592eb83ceb774492f65a2b82
https://doi.org/10.1109/estc.2018.8546450
https://doi.org/10.1109/estc.2018.8546450
Autor:
Frank Ellinger, Patrick Seiler, David Fritsche, Corrado Carta, Dirk Plettemeier, Sebastian Lungen, Krzysztof Nieweglowski, Karlheinz Bock
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this work, a polyimide (PI) foil-based wireless transceiver, which can be placed on the top of each node chip stack, is proposed. The transceivers with Butler matrix (BM) steered antenna arrays enable directed links from each node on one PCB towar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f95a20cd002875cebfa99b26515d31d5
https://doi.org/10.1109/ectc.2018.00083
https://doi.org/10.1109/ectc.2018.00083
Autor:
Dirk Plettemeier, Krzysztof Nieweglowski, Niels Neumann, Sujay Charania, Sebastian Lungen, Zaid Al-Husseini, Karlheinz Bock, Sebastian Killge, Johann W. Bartha
Publikováno v:
SPIE Proceedings.
Current trends in electronic industry, such as Internet of Things (IoT) and Cloud Computing call for high interconnect bandwidth, increased number of active devices and high IO count. Hence the integration of on silicon optical waveguides becomes an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0d75b741bc882852c164700c9ff1c1cc
https://doi.org/10.1117/12.2264811
https://doi.org/10.1117/12.2264811
Autor:
Lukas Lorenz, Krzysztof Nieweglowski, Johann W. Bartha, Sebastian Killge, Sebastian Lungen, Tobias Tiedje, Sujay Charania, Karlheinz Bock
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this work we discuss optical coupling technologies for the manufacturing of out-of-plane optics integrated in planar waveguide for interposer-and board-level. Each technology is evaluated on a silicon interposer with optical dielectric through sil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abd1a812d92d43ed0445a74bf57d2918
https://doi.org/10.1109/ectc.2017.273
https://doi.org/10.1109/ectc.2017.273
Autor:
Krzysztof Nieweglowski, Marco Luniak, Karlheinz Bock, Tobias Tiedje, Martin Schubert, Sebastian Lungen
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The fan-out wafer level package (FOWLP) became rapidly developed towards a major advanced packaging solution. This technology creates a mold cast to embed bare dies by compression molding. Subsequently this mold cast serves as a substrate for the red
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3856ba5cf006ddd30f55d851f259fe8
https://doi.org/10.1109/ectc.2017.276
https://doi.org/10.1109/ectc.2017.276
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
The complete SMD-mounting process is a complex superposition of a lot of influences. There are general material (SMD-components, printed boards, solder paste, printing stencil), geometrical (layout) and process (solder paste printer, assembling equip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08e261f192b25a9162575c6eb6ff2d6c
https://doi.org/10.1109/isse.2016.7563194
https://doi.org/10.1109/isse.2016.7563194
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE).
In this paper an investigation on vacuum vapour phase soldering processes is presented. The purpose is to identify influencing factors of the solder profile with regard to the quality of the solder joint. For this the vacuum and the temperature profi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be0ea8095c9589cb8845775978e066f5
https://doi.org/10.1109/isse.2015.7247993
https://doi.org/10.1109/isse.2015.7247993