Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Sebastian Holtkämper"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2021:000112-000117
Ultrasonic welding is a common and indispensable technology in the packaging of power electronics. Typical applications are terminals and power contacts, e.g. in motor drive or inverter modules, as well as busbar connections. The process control requ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e64c7b002c8eb5e3c63cb3a8a9b2a1a4
https://doi.org/10.4071/2380-4491.2021.hitec.000112
https://doi.org/10.4071/2380-4491.2021.hitec.000112
