Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Sean Chew"'
Autor:
Sean Chew, Tor-Salve Dalsgaard, Martin Maunsbach, Hasti Seifi, Joanna Bergström, Kasper Hornbæk, Josu Irisarri, Iñigo Ezcurdia, Naroa Iriarte, Asier Marzo, William Frier, Orestis Georgiou, Anna Sheremetieva, Kamil Kwarciak, Maciej Stroinski, Daria Joanna Hemmerling, Mykola Maksymenko, Antonio Cataldo, Marianna Obrist, Patrick Haggard, Sriram Subramanian
Publikováno v:
Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60b7fd2384b1980f0c54c891b60c404f
https://doi.org/10.1145/3544549.3583913
https://doi.org/10.1145/3544549.3583913
Autor:
Hasti Seifi, Sean Chew, Antony James Nascè, William Edward Lowther, William Frier, Kasper Hornbæk
Publikováno v:
Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9947375904f066983b6710b8896972fe
https://doi.org/10.1145/3544548.3580728
https://doi.org/10.1145/3544548.3580728
Publikováno v:
Materials Science Forum. 857:93-97
In the past few decades, the lead-tin soldering process had been widely used in electronics sector as an interconnection between the electronics components and printed circuit board. Due to the highly toxicity and environmental concerns, the lead-tin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e433c53b38d7fa2011d6d681b0254d4
https://doi.org/10.4028/www.scientific.net/msf.857.93
https://doi.org/10.4028/www.scientific.net/msf.857.93
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p461-465, 5p
Publikováno v:
Applied Sciences (2076-3417); Oct2024, Vol. 14 Issue 20, p9494, 24p
Autor:
Eisen, Joel B.1, Payne, Heather E.2
Publikováno v:
Brigham Young University Law Review. 2023, Vol. 48 Issue 4, p1057-1134. 78p.
Publikováno v:
Economics of Energy & Environmental Policy; Sep2023, Vol. 12 Issue 2, p49-67, 19p
Publikováno v:
Fair Disclosure Wire (Quarterly Earnings Reports). 08/26/2021.
Autor:
SHERLOCK, SHEILA
Publikováno v:
British Medical Bulletin; May1972, Vol. 28 Issue 2, p109-113, 5p
Autor:
WRIGHT, RALPH
Publikováno v:
British Medical Bulletin; May1972, Vol. 28 Issue 2, p120-124, 5p