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of 3
pro vyhledávání: '"Sean Branagan"'
Publikováno v:
ECS Meeting Abstracts. :1050-1050
As on-chip interconnect sizes continue to shrink to address the increased device density needs at 7 nm nodes and beyond, copper interconnects start showing an increase of electrical resistivity compared to bulk copper due to the scaling effect. Recen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88a5fb4593bb2ac97bca2cf219e7aaf7
https://doi.org/10.1149/ma2019-01/18/1050
https://doi.org/10.1149/ma2019-01/18/1050
Publikováno v:
Academic Entrepreneurship and Community Engagement ISBN: 9780857936400
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ffa0d9b641ab2c8076d920ea979db385
https://doi.org/10.4337/9780857936400.00009
https://doi.org/10.4337/9780857936400.00009
Publikováno v:
Lab on a Chip; Sep2008, Vol. 8 Issue 10, p1625-1631, 7p