Zobrazeno 1 - 5
of 5
pro vyhledávání: '"SeWoong Cha"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001486-001519
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69cc355904652d7a5f3aa242c7db1635
https://doi.org/10.4071/2013dpc-wp23
https://doi.org/10.4071/2013dpc-wp23
Publikováno v:
2010 IEEE CPMT Symposium Japan.
There have been tremendous demands on portable electronic devices since last decade and board level drop performance has become one of the major concerns in microelectronic ball grid array (BGA) package. Most studies focused on material selection of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0803e3421c9858d147492b86304b97da
https://doi.org/10.1109/cpmtsympj.2010.5679662
https://doi.org/10.1109/cpmtsympj.2010.5679662
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Recent data [Syed, A., et al., "Alloying Effect of Ni, Co, and Sb in SAC solder for Improved Drop Performance of Chip Scale Packages with Cu OSP Pad Finish," Proceedings of the 8th EPTC conference, 2006, pp. 404-411.] shows that significant improveme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d9700b2bff49ae03394216e77a2dd09
https://doi.org/10.1109/ectc.2007.373845
https://doi.org/10.1109/ectc.2007.373845
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Recent industry data show that the drop/impact reliability of Chip Scale Packages has been detrimentally affected by switching to SAC alloys with Ag percent equal to or greater than 3%. The primary cause of this is attributed to the higher strength a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f38c81a0f321351a45cd2f4d65ebbbeb
https://doi.org/10.1109/ectc.2007.373911
https://doi.org/10.1109/ectc.2007.373911
Publikováno v:
2010 IEEE CPMT Symposium Japan; 2010, p1-5, 5p