Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Se-Ra Jeon"'
Autor:
Doogyu Lee, Jungmin Lee, Eunji Lee, Jeongjin Lee, Seung Yoon Lee, Chan Hwang, Pieter Kapel, Seung-Bin Yang, Mi-Yeon Baek, Jeroen Wefers Bettink, Se-Ra Jeon, Thomas Kim, Aileen Soco, Olger Zwier, Koen van Witteveen
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ad1127e0f7bc38e25c6b515cbc924a2
https://doi.org/10.1117/12.2627719
https://doi.org/10.1117/12.2627719
Autor:
Jenny Yueh, Miguel Garcia Granda, Seung-Bin Yang, Seung Yoon Lee, Elliott McNamara, Ewoud van West, Bart Segers, Yoon-Tae Lee, Se-Ra Jeon, Ali Ghavami, Yutao Gui, Joon-Soo Park, Daniel Park, Koshiba Dakeshi, Frank Staals, Jeongjin Lee, Chan Hwang, Inbeom Yim, Se-Hui Lee, Eric Janda
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
In order to meet the tightened lithography performance requirement for EUV systems, a good on-product focus control with accurate metrology is essential. In this manuscript we report on a novel metrology solution for the EUV on-product focus measurem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c15bb826d524b92a922ae00f30542136
https://doi.org/10.1117/12.2553246
https://doi.org/10.1117/12.2553246
Autor:
Se-Ra Jeon, Chan Hwang, Jeongijn Lee, Arie Jeffrey Den Boef, Seung-Bin Yang, Woo-young Jung, Seung Yoon Lee, Farzad Farhadzadeh, Simon Gijsbert Josephus Mathijssen, Daniel Park, Jinsun Kim, Won-Jae Jang, Joon-Soo Park, Marc Noot, Kaustubh Padhye, Oh-Sung Kwon, Kaustuve Bhattacharyya
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
In multi patterning processes, overlay is now entangled with CD including OPC and stochastics. This combined effect is a serious challenge for continued shrink and is driving down the allowed overlay margin to an unprecedented level. We need to do ev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e808e901e4b35035acb96b03435966a
https://doi.org/10.1117/12.2551676
https://doi.org/10.1117/12.2551676
Autor:
Jang-Sun Kim, Jin-Moo Byun, Lancee, Remco, Jong-Hyun Hwang, Hyun-Jun Ha, Kwang-Young Hu, Se-Ra Jeon, Won-Jae Jang, Hyung-Sub Son, van der Meijden, Vidar, Noot, Marc, Foltynski, Bartosz, Macht, Lukasz, Grzela, Grzegorz, Grouwstra, Cedric
Publikováno v:
Proceedings of SPIE; 1/22/2019, Vol. 10959, p1-7, 7p
Autor:
Marc Noot, Elliott McNamara, Chan Hwang, Kaustuve Bhattacharyya, Seung Yoon Lee, Frank van de Mast, Nang-Lyeom Oh, Se-Ra Jeon, Joost van Heijst, Noh-Kyoung Park, Arie Jeffrey Den Boef, Kun-tack Lee, Kevin An, SeungHwa Oh, Greet Storms
Publikováno v:
SPIE Proceedings.
With the increase of process complexity in advanced nodes, the requirements of process robustness in overlay metrology continues to tighten. Especially with the introduction of newer materials in the film-stack along with typical stack variations (th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efd0e3530c1f43ec58e9259ce2f607b1
https://doi.org/10.1117/12.2222040
https://doi.org/10.1117/12.2222040