Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Se-Jung Moon"'
Publikováno v:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium.
When PCIe 5.0 CEM connector testing result came out differently depending on the 2X-Thru de-embedding tools, we performed the tool accuracy test adopting the IEEE 370 specification and the framework. The key to success in this test was to ensure that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d101379e394cb9e7011bf9d342b1a707
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559137
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559137
Autor:
Chien-Ping Kao, Guo Jong-Ru, Jianting Li, Beomtaek Lee, Se-Jung Moon, Xinjun Zhang, Hansel Dsilva
Publikováno v:
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI).
In the high-speed differential (HSD) interface design, the intra-pair skew becomes more critical as the link speed is ever increasing beyond 56Gbps+ signaling. The skew within a differential pair (intra-pair skew) deteriorates eye opening at the rece
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::56b9e25e5a6299d1d851ace3adce4f4e
https://doi.org/10.1109/spi52361.2021.9505188
https://doi.org/10.1109/spi52361.2021.9505188
Publikováno v:
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI).
PCI SIG (peripheral component interconnect special interest group) adapted the ccICN (component contribution integrated crosstalk noise) for PCIe CEM (card electromechanical) specification in limiting the connector crosstalk for 32Gbps NRZ (non-retur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4df153392de79a748a54a6ed3fb5ad0
https://doi.org/10.1109/spi52361.2021.9505209
https://doi.org/10.1109/spi52361.2021.9505209
Publikováno v:
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
In this work, we apply electromagnetic domain decomposition (EDD) to separate through-hole mounting (THM) connector models into two sub-domains: the connector body and the PCB section. The sub-domain models were simulated and then concatenated in ord
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b12a5ea0db4580a9cf91d038dbb7488
https://doi.org/10.1109/epeps47316.2019.193205
https://doi.org/10.1109/epeps47316.2019.193205
Publikováno v:
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
High-speed VNA pico-probe calibration can be a very tedious process and is one of the most important and time consuming parts of collecting good S-parameter data. When performing multi-port probe calibrations using a calibration substrate, an operato
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f94286dcc0e217b6e5c43bf44fc76078
https://doi.org/10.1109/isemc.2019.8825195
https://doi.org/10.1109/isemc.2019.8825195
Publikováno v:
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
For successful high-speed system design, accurate component characterization is essential. The component is often mounted on a printed circuit board (PCB) for the characterization. The removal of the fixture parasitic effects is critical. The fixture
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94bdb0744b4794c2055500564c51875d
https://doi.org/10.1109/isemc.2019.8825192
https://doi.org/10.1109/isemc.2019.8825192
Publikováno v:
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
In today's high-speed interconnect design, crosstalk is a critical parameter and the accurate measurement is very important. However, in the calibration procedure, the fixture crosstalk is usually ignored to avoid over-complicated de-embedding algori
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c08c5637d2ac5fb70094b45b92ca2417
https://doi.org/10.1109/isemc.2017.8077925
https://doi.org/10.1109/isemc.2017.8077925
Publikováno v:
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.
In this paper, TRL (Through-Reflect-Multiple Lines) and 2x thru de-embedding schemes of AFR (Automatic Fixture Removal) and SFD (Smart Fixture De-embedding) are compared from various perspectives: calibration fixture design, calibration / de-embeddin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08037f000c47d20c0fc2e227fc4e799d
https://doi.org/10.1109/emcsi.2015.7107681
https://doi.org/10.1109/emcsi.2015.7107681
Publikováno v:
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.
This paper proposes new frequency-domain (FD) metrics to evaluate and optimize interconnects for high-speed IO. In this paper, we focused on a spring-probe socket for interconnects and PCIe Gen3 for the high-speed IO. For design optimization, we adap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb1ba40af2d08ae17567dd3c5352838d
https://doi.org/10.1109/epeps.2011.6100192
https://doi.org/10.1109/epeps.2011.6100192
Publikováno v:
2010 IEEE International Symposium on Electromagnetic Compatibility.
The time-domain vector fitting (TDVF) [1] was proven to be an extrapolation method which provides about a ten-fold lengthening of a recorded time-domain response and reducing Gribbs phenomenon due to the limited length of the response and its abrupt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80c1ecc5339fca4eebd8f995278dbdf8
https://doi.org/10.1109/isemc.2010.5711338
https://doi.org/10.1109/isemc.2010.5711338