Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Se Chuel Park"'
Autor:
I.S. Bae, Hong Chan Kim, Sung-Il Kang, Se Chuel Park, Larry Marcanti, John Marke, Richard Coyle, Joe Smetana
Publikováno v:
IMAPSource Proceedings. 2022
Lead-frames have been widely used in the semiconductor package assembly field, and QFN (Quad flat no leads) has the advantages of miniaturization and cost reduction of the semiconductor package. It has had limited use in automotive or defense product
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c740fd1d0bf77ee0eda5f012d0192f9
https://doi.org/10.4071/001c.74533
https://doi.org/10.4071/001c.74533
Publikováno v:
IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..
For the development of semiconductor package, size reduction and high performance are driving forces. As increasing hand held products and green round issue, all package companies are interesting in study of package using lead free solder. As the tod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b119841b21bba3de4de7402e08029a19
https://doi.org/10.1109/iemt.2003.1225874
https://doi.org/10.1109/iemt.2003.1225874
Publikováno v:
IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003; 2003, p31-37, 7p