Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Scott Trask"'
Autor:
Andrew B Hall, Scott Trask, Stacy Shackelford, Jennifer M. Gurney, Christopher Mahoney, Ramey L. Wilson, Iram Qureshi, Jonathan Taylor, Avery Walker
Publikováno v:
Journal of Trauma and Acute Care Surgery. 91:S256-S260
BACKGROUND Combat casualty care has been shaped by the prolonged conflicts in Southwest Asia, namely Afghanistan, Iraq, and Syria. The utilization of surgeons in austere locations outside of Southwest Asia and its implication on skill retention and v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8f1f87fc064b3efcdf627a6dbb004fa
https://doi.org/10.1097/ta.0000000000003095
https://doi.org/10.1097/ta.0000000000003095
Autor:
H. A. Scott Trask
Publikováno v:
The Quarterly Journal of Austrian Economics. 8:35-54
Sumner was the product of an indigenous American hard-money tradition that embraced free markets, free trade, and sound banking—a tradition that has much in common with the Austrian School in its theoretical and political orientation. His understan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15585bd37d3c65060a4716947d8a5794
https://doi.org/10.1007/s12113-005-1021-6
https://doi.org/10.1007/s12113-005-1021-6
Autor:
Kejian Chen, Scott Trask, David Bastiansen, James C. Valentine, Alexander Chao, Donel Elshire, Brenda Nelson, Wendy Ziegler, Jeffery Kang, Jeffery Borut
Publikováno v:
The American surgeon. 78(10)
Temporary vascular shunts (TVSs) are relied on frequently in the current military theater. Details of their physiology and outcome are of increasing interest and needed to further define their place in the management of trauma. This study was conduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::669d38cfe6b4012c97205a73940752e8
https://pubmed.ncbi.nlm.nih.gov/23025937
https://pubmed.ncbi.nlm.nih.gov/23025937
Publikováno v:
SPIE Proceedings.
Photonics packaging applications require significantly higher precision die bonding processes than traditional electronics and RF/microwave devices. Die placement accuracy of microns and better has been demonstrated. Key factors affecting the capabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a3e00bb26c18e88e84958f9913202ad
https://doi.org/10.1117/12.475483
https://doi.org/10.1117/12.475483