Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Scott Popelar"'
Autor:
Sean Brinlee, Scott Popelar, Ph.D.
Publikováno v:
IMAPSource Proceedings. 2022
Solder fatigue failure is one of the primary wear out failure mechanisms limiting reliability in microelectronics flip chip packaging. Solder fatigue failure occurs when a crack initiates and subsequently propagates through the entirety of the solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf36d7c05ae2fb0e96239aba3f49f059
https://doi.org/10.4071/001c.74728
https://doi.org/10.4071/001c.74728
Publikováno v:
International Symposium on Microelectronics. 2021:000195-000200
The experimental study described herein investigates thermomigration of both eutectic Sn/Pb and lead free Sn/Ag/Cu solder joints, with the additional focus on the development of an Arrhenius failure model of time-to- failure as a function of temperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f3a42c18c648e09304a859a2d938c2c
https://doi.org/10.4071/1085-8024-2021.1.000195
https://doi.org/10.4071/1085-8024-2021.1.000195
Publikováno v:
Microelectronics Reliability. 42:265-283
Electroless nickel and immersion gold plating technologies (e-Ni/Au) have traditionally been used almost exclusively within the electronics industry to create a solderable surface on substrate materials, e.g. laminate boards. Recent advances in these
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7d9e1b4f2030e2e29294a7dad38ec6b
https://doi.org/10.1016/s0026-2714(01)00236-0
https://doi.org/10.1016/s0026-2714(01)00236-0