Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Scott N. Schiffres"'
Publikováno v:
Engineering, Vol 26, Iss , Pp 185-197 (2023)
The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a
Externí odkaz:
https://doaj.org/article/6a7103d330984b27b40bad3f56127b61
Autor:
Arad Azizi, Fatemeh Hejripour, Jacob A. Goodman, Piyush A. Kulkarni, Xiaobo Chen, Guangwen Zhou, Scott N. Schiffres
Publikováno v:
Rapid Prototyping Journal. 29:1109-1120
Purpose AlSi10Mg alloy is commonly used in laser powder bed fusion due to its printability, relatively high thermal conductivity, low density and good mechanical properties. However, the thermal conductivity of as-built materials as a function of pro
Autor:
John J. Bowen, Shahryar Mooraj, Jacob A. Goodman, Siyuan Peng, Dayton P. Street, Benito Roman-Manso, Emily C. Davidson, Kara L. Martin, Lisa M. Rueschhoff, Scott N. Schiffres, Wen Chen, Jennifer A. Lewis, Matthew B. Dickerson
Publikováno v:
Materials Today. 58:71-79
Autor:
Ghazal Mohsenian, Srikanth Rangarajan, Bahgat Sammakia, Scott N. Schiffres, Leila Choobineh, Mohammad I. Tradat, Cong Hiep Hoang, Yaman M. Manaserh, Alfonso Ortega
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1565-1582
In this review, the heat transfer characteristics of several pumped two-phase electronic cooling technologies are quantitatively examined and compared on the basis of heat flux, coolant temperatures, heat source area, base temperature, and coolant ty
Autor:
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Publikováno v:
Journal of Electronic Packaging. 145
More than ever before, data centers must deploy robust thermal solutions to adequately host the high-density and high-performance computing that is in high demand. The newer generation of central processing units (CPUs) and graphics processing units
Autor:
Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Publikováno v:
Journal of Electronic Packaging. 144
The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that t
Publikováno v:
Carbon. 155:580-586
It remains controversial whether the substrate affects the wettability of a single graphene sheet. In this manuscript, we investigate if adsorption transparency exists for graphene, analogous to the contact angle transparency previously reported. The
Publikováno v:
PLoS ONE, Vol 10, Iss 5, p e0125862 (2015)
Thermal conductivity of dimethyl-sulfoxide (DMSO) solution is measured in this study using a transient hot wire technique, where DMSO is a key ingredient in many cryoprotective agent (CPA) cocktails. Characterization of thermal properties of cryoprot
Externí odkaz:
https://doaj.org/article/f701681e0c924935af04718ace010613
Autor:
Yaman M. Manaserh, Bharath Ramakrisnan, Yaser Hadad, Srikanth Rangarajan, Bahgat Sammakia, Scott N. Schiffres, Cong Hiep Hoang, Mohammad I. Tradat
The miniaturization of microelectronic devices and an increasing demand for faster computing results in high heat flux applications. By adopting direct liquid cooling, the high heat flux and high-power demands can be met. In this paper, thermo-hydrau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30d0eaeff3c5f652e563ee8fd4d65be8
https://doi.org/10.1115/1.0003630v
https://doi.org/10.1115/1.0003630v
Autor:
Scott N. Schiffres, Bahgat Sammakia, Arad Azizi, Srikanth Rangarajan, Kourosh Nemati, Ghazal Mohsenian, Cong Hiep Hoang, Vahideh Radmard, Najmeh Fallahtafti
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
As heterogeneous integration evolves, the diversity and density of devices that combine multiple functionalities has significantly increased. The subsequent increase in power usage and reduced size of components, specifically of Central Processing Un