Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Scott McCann"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1917-1924
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53cd769a0d02db2914876f681cff14db
https://doi.org/10.1109/tcpmt.2021.3123212
https://doi.org/10.1109/tcpmt.2021.3123212
Publikováno v:
Journal of Mechanical Design. :1-15
Bayesian optimization (BO) is an efficient and flexible global optimization framework that is applicable to a very wide range of engineering applications. To leverage the capability of the classical BO, many extensions, including multi-objective, mul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3cab61c7b6b298ad442125c2f81c7355
https://doi.org/10.1115/1.4052445
https://doi.org/10.1115/1.4052445
Bayesian optimization (BO) is an efficient and flexible global optimization framework that is applicable to a very wide range of engineering applications. To leverage the capability of the classical BO, many extensions, including multi-objective, mul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::595bfb7e96eecc215d1319bb6c3bcdce
http://arxiv.org/abs/2007.03502
http://arxiv.org/abs/2007.03502
Publikováno v:
Journal of Computing and Information Science in Engineering. 20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec661924f23404e12015f052b938bdcf
https://doi.org/10.1115/1.4047210
https://doi.org/10.1115/1.4047210
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This paper presents a finite element modeling methodology to predict failure during four-point monotonic bend test of flip-chip ball grid array (FCBGA) packages mounted on printed circuit boards (PCBs). Monotonic bend tests are conducted to failure a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccea32dcc01b7b8eb68608937eae076d
https://doi.org/10.1109/ectc32862.2020.00323
https://doi.org/10.1109/ectc32862.2020.00323
Publikováno v:
Journal of Computing and Information Science in Engineering. 20
Bayesian optimization (BO) is an efiective surrogate-based method that has been widely used to optimize simulation-based applications. While the traditional Bayesian optimization approach only applies to single-fidelity models, many realistic applica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::417f2ac80ef75efbbf10b6f767346c1f
https://doi.org/10.1115/1.4046697
https://doi.org/10.1115/1.4046697
High-fidelity complex engineering simulations are highly predictive, but also computationally expensive and often require substantial computational efforts. The mitigation of computational burden is usually enabled through parallelism in high-perform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d7d4c55dc2e05d82501c0d21535088dc
http://arxiv.org/abs/2003.09436
http://arxiv.org/abs/2003.09436
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 17:585-592
Glass substrates have gained increasing attention for packaging due to their ideal material properties; however, the brittle nature of glass poses a challenge. This paper focuses on glass cracking due to dicing-induced defects and redistribution laye
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f079a4a36ab0e65a39f4025a9a23e8e
https://doi.org/10.1109/tdmr.2017.2738625
https://doi.org/10.1109/tdmr.2017.2738625
Autor:
Vidya Jayaram, Scott McCann, Raj Pulugurtha, Vanessa Smet, Venky Sundaram, Urmi Ray, Rao Tummala, Bhupender Singh, Gary Menezes
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:726-733
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5- $\mu \text{m}$ lithographic design rules,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cbcb402fa80ac7c95c248ceb8f75d95
https://doi.org/10.1109/tcpmt.2017.2684464
https://doi.org/10.1109/tcpmt.2017.2684464
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. :1-8
This paper compares the warpage after lead-free solder assembly of ultrathin glass and organic substrates for microelectronic packages. Smart mobile devices demand packages to be thinner, which exacerbates warpage, which in turn affects interconnect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9dcb0e4fccd73fae461a107fbe34b42
https://doi.org/10.1109/tcpmt.2016.2641164
https://doi.org/10.1109/tcpmt.2016.2641164