Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Scott J. Badgley"'
Publikováno v:
Journal of Electronic Packaging. 115:147-152
The thermal cyclic shear stress/strain hysteresis response and associated steady-state creep parameters of 97Sn-3Cu solder joints have been determined using a beam specimen previously developed by Pao et al. (1992a). The solder joint was subjected to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76a2d5762256071c21f29585fa7656bb
https://doi.org/10.1115/1.2909310
https://doi.org/10.1115/1.2909310
Publikováno v:
Journal of Electronic Packaging. 115:1-8
A solder joint specimen has been designed to determine the stress/strain hysteresis response and fracture behavior of 90 percent wtPb/10 percent wtSn solder alloy. The specimen consists of an Al2O3 beam and an Al 2024-T4 beam bonded together at the e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abbf6b6fc2fc318674eb5318e6655aa2
https://doi.org/10.1115/1.2909296
https://doi.org/10.1115/1.2909296
Autor:
Ron Cooper, Linda J. Baumgartner, Richard L. Allor, R. K. Govila, Yi-Hsin Pao, Scott J. Badgley
Publikováno v:
Journal of Electronic Packaging. 114:135-144
Failures in electronic packages under thermal fatigue usually result from cracking in solder joints due to creep/fatigue crack growth. Understanding the stress/strain behavior of such solder joints is the first step in characterizing their fracture b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9e9f1ad8e0d48210dcbac9d913111fa
https://doi.org/10.1115/1.2906410
https://doi.org/10.1115/1.2906410
