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pro vyhledávání: '"Schrinsky, A. J."'
Patterning and etch challenges for future DRAM and other high aspect ratio memory device fabrication
Autor:
Zhang, Ying, Oehrlein, Gottlieb S., Lin, Qinghuang, Rueger, N. R., McGinnis, A., Good, F., Schrinsky, A. J., Kiehlbauch, M.
Publikováno v:
Proceedings of SPIE; March 2013, Vol. 8685 Issue: 1 p86850E-86850E-15, 8598166p