Zobrazeno 1 - 10
of 80
pro vyhledávání: '"Schmiga, C."'
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Rühle, K., Rauer, M., Rüdiger, M., Giesecke, J., Niewelt, T., Schmiga, C., Glunz, S.W., Kasemann, M.
Publikováno v:
In Energy Procedia 2012 27:406-411
Autor:
Steinhauser, B., Arya, V., Jakob, L., Heinz, F., Schmiga, C., Grübel, B., Brand, A., Kluska, S., Nekarda, J.
Herein, an analysis on the impact of laser contact opening of TOPCon/SiNx stacks is presented. By etching in tetramethylammonium hydroxide (TMAH), the defect distribution in the interfacial tunnel oxide is accessed and analyzed. The defect density is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::0eb1091eed8d54e4811fcc3481307e36
https://publica.fraunhofer.de/handle/publica/416595
https://publica.fraunhofer.de/handle/publica/416595
Autor:
Kluska, S., Grübel, B., Cimiotti, G., Schmiga, C., Berg, H., Beinert, A., Kubitza, I., Müller, P., Voss, T., Kenny, R., Serra, J.M.
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::c87156f2239932acc76d67738570c98e
https://publica.fraunhofer.de/handle/publica/416069
https://publica.fraunhofer.de/handle/publica/416069
Autor:
Arya, V., Steinhauser, B., Grübel, B., Schmiga, C., Bay, N., Brunner, D., Passig, M., Brand, A.A., Kluska, S., Nekarda, J.
Herein, an alternative approach of metallization on tunnel oxide passivated contacts (TOPCon) devices, through the method of localized laser ablation and nickel-copper plating, is presented. The method is demonstrated to be a viable and effective alt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::3ab22beff666b8cf29d11288939583d3
https://publica.fraunhofer.de/handle/publica/265394
https://publica.fraunhofer.de/handle/publica/265394
Autor:
Kluska, S., Hatt, T., Grübel, B., Cimiotti, G., Schmiga, C., Arya, V., Steinhauser, B., Feldmann, F., Bartsch, J., Goraya, B.S., Nold, S., Brand, A.A., Nekarda, J., Glatthaar, M., Glunz, S.W.
Passivated-contact solar cell designs, such as TOPCon or silicon heterojunction solar cells (SHJs), enable cell efficiencies greater than 24%, and are promising candidates for the next revolution in mass production after the passivated emitter and re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::9e90a26d23aa936d94cb7db41e90f415
https://publica.fraunhofer.de/handle/publica/263254
https://publica.fraunhofer.de/handle/publica/263254
Autor:
Steinhauser, B., Grübel, B., Nold, S., Arya, V., Schmiga, C., Kluska, S., Brand, A.A., Feldmann, F., Bay, N., Gay, X., Passig, M., Glatthaar, M.
37th European Photovoltaic Solar Energy Conference and Exhibition; 179-183
i-TOPCon solar cells commonly make use of a TOPCon/SiNx stack at the rear side. For screen-printed contacts, a certain TOPCon layer thickness in the range of 110 to 150 n
i-TOPCon solar cells commonly make use of a TOPCon/SiNx stack at the rear side. For screen-printed contacts, a certain TOPCon layer thickness in the range of 110 to 150 n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20855073717a4abbb87ea50be4194e33
Publikováno v:
In Solar Energy Materials and Solar Cells 2006 90(18):3179-3186
We present a detailed study on aluminum-boron codoping of silicon by alloying from screen-printed aluminum pastes containing boron additives (Al-B pastes). We derive an analytical model for the formation of the Al-B acceptor profiles by quantitativel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::4d8229f715cab026083d99ca54bafddd
https://publica.fraunhofer.de/handle/publica/244822
https://publica.fraunhofer.de/handle/publica/244822
Autor:
Terheiden, B., Ballmann, T., Horbelt, R., Schiele, Y., Seren, S., Ebser, J., Hahn, G., Mertens, V., Koentopp, M.B., Scherff, M., Müller, J.W., Holman, Z.C., Descoeudres, A., Wolf, S. de, Nicolas, S.M. de, Geissbuehler, J., Ballif, C., Weber, B., Saint-Cast, P., Rauer, M., Schmiga, C., Glunz, S.W., Morrison, D.J., Devenport, S., Antonelli, D., Busto, C., Grasso, F., Ferrazza, F., Tonelli, E., Oswald, W.
Reducing wafer thickness while increasing power conversion efficiency is the most effective way to reduce cost per Watt of a silicon photovoltaic module. Within the European project 20 percent efficiency on less than 100-mu m-thick, industrially feas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::f94231f8ba0a85105665cb7b7f374ad7
https://publica.fraunhofer.de/handle/publica/239368
https://publica.fraunhofer.de/handle/publica/239368