Zobrazeno 1 - 10
of 84
pro vyhledávání: '"Schlottig, G."'
Publikováno v:
In Microelectronics Reliability November 2020 114
Autor:
Schlottig, G.
Publikováno v:
None
This book describes a setup that allows to delaminate the Silicon-to-Molding Compound interface for obtaining interfacial fracture parameters: the Mixed Mode Chisel setup (MMC). With this device for the first time the delamination can be initiated an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b57184814af75c04a370d545ca53ded0
http://resolver.tudelft.nl/uuid:926bb24d-973f-4f1b-93da-4e6cde8fbbda
http://resolver.tudelft.nl/uuid:926bb24d-973f-4f1b-93da-4e6cde8fbbda
Autor:
Kleff, J., Schlottig, G., Mrossko, R., Steller, W., Oppermann, H., Keller, J., Brunschwiler, T.
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-6, 6p
Publikováno v:
2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-4, 4p
Autor:
Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.
Publikováno v:
2015 16th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems; 2015, p1-8, 8p
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1976-1980, 5p
Autor:
Wunderle, B., Schulz, M., Keller, J., Schlottig, G., Maus, I., May, D., Holck, O., Pape, H., Michel, B.
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1459-1467, 9p
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1090-1096, 7p
Publikováno v:
2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2010, p1-5, 5p
Publikováno v:
Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-5, 5p