Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Sayanu Pamidighantam"'
Publikováno v:
Cureus.
Autor:
Sayanu Pamidighantam, Neela Chattoraj, Kuppi Srinivasa Reddy, Jibendu Sekhar Roy, Raghavendra Govindra Kulkarni, Vittal Janardhana
Publikováno v:
Progress In Electromagnetics Research Letters. 27:171-178
In this paper, a surface micromachined microwave tunable low pass fllter, consisting of tunable shunt capacitors and series inductors, has been realized. The fllter exhibits insertion loss of less than 1dB (up to 10GHz), stop band attenuation of 20dB
Publikováno v:
International Journal of Materials Science and Engineering. 1:79-81
Epoxy based photopolymer–SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Wave guide (CPW) transmission lines are chosen as test vehicles. Tra
Publikováno v:
Sensors and Actuators A: Physical. 103:202-212
This paper reports on the development of a generic wet release process for the fabrication of suspended slender and compliant micromechanical structures of poly-SiGe, poly-Si and aluminium with thickness values in the range 0.5–2 mm and gap spacing
Publikováno v:
Journal of Micromechanics and Microengineering. 12:458-464
In this paper, a closed-form expression for the pull-in voltage of fixed–fixed beams and fixed–free beams is derived starting from the known expression of a simple lumped spring-mass system. The effects of partial electrode configuration, of axia
Autor:
V. Janardhana, Srinivasa Reddy Kuppireddi, Sayanu Pamidighantam, Jibendu Sekhar Roy, R.G. Kulkarn, Oddvar Søråsen
Publikováno v:
NORCHIP
Epoxy based photo polymer — SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Waveguide transmission lines are chosen as test vehicles. Transmi
Publikováno v:
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).
This paper reports on the development of a novel wet-release process for the fabrication of slender and compliant micro-mechanical structures with sub-micron gap spacing developed in an in-house CMOS compatible 8" pilot line. A Self Assembled Monolay
Publikováno v:
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).
This paper reports on the hermeticity testing of MEMS cavities using BCB as the sealing and bonding material. Hermeticity has been tested according to the MIL-STD-883D. Gross leak testing based on liquid fluorocarbons revealed that BCB sealed cavitie