Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Satyajit Shinde"'
Publikováno v:
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Nitride film LPCVD (Low Pressure Chemical Vapor Deposition) process is well known in semiconductor industry. The paper covers an innovative approach in touching two aspects of improvement in LPCVD nitride process in diffusion furnace. First is the ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8df0172126b4131f5e209a02fa528c12
https://doi.org/10.1109/asmc49169.2020.9185301
https://doi.org/10.1109/asmc49169.2020.9185301
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Minimal wafer loss is the goal of companies particularly in the cut throat semi-conductor industry. Unwanted moisture on the wafer surface at front end of the line can lead to defects in subsequent process steps. Typically, wafer surface exposed to m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70dd9ec4f5a62e03894a9be14efef7a9
https://doi.org/10.1109/asmc.2019.8791754
https://doi.org/10.1109/asmc.2019.8791754
Autor:
Satyajit Shinde, Garrett Szafman, Bradley Savoy, Jaana S. Rajachidambaram, Chihyun Jung, Shiladitya Chakravorty
Publikováno v:
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
In semiconductor manufacturing regular tool monitoring is essential for quality control. For the case of furnace tools tool monitoring is done by processing tool qualification wafers on tools followed with measurements on the wafers. Regular tool qua
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0b586cb7e5c0ee2e6932b0d125352dd
https://doi.org/10.1109/asmc.2018.8373205
https://doi.org/10.1109/asmc.2018.8373205
Publikováno v:
Journal of Materials Science. 41:5699-5703
A significant amount of work has been published on the combustion synthesis of nickel aluminides including thermal explosion and SHS type of ignition, [1–4]. In the SHS of nickel aluminides, nickel and aluminum powders are mixed in the desired comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61c1acfec9f5d2dffe11bb866e3350c9
https://doi.org/10.1007/s10853-006-0068-x
https://doi.org/10.1007/s10853-006-0068-x
Publikováno v:
Materials Science and Engineering: A. 426:283-288
Elemental powder mixing prior to processes such as self-propagating high temperature synthesis (SHS) is a vital processing step that needs careful consideration. This is particularly true for powders with submicron particle sizes. The present paper i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::281d8c71c9f0846141df3b26642074dd
https://doi.org/10.1016/j.msea.2006.04.027
https://doi.org/10.1016/j.msea.2006.04.027
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
“Cycle Time Drives Everything”. The commitment of product delivery on time is paramount in any industry. It is particularly important in the brutal fast paced semi-conductor manufacturing industry due to tremendous competition in the market. Up u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eee0692b96ca636170bdc375bf93bed3
https://doi.org/10.1109/asmc.2013.6552782
https://doi.org/10.1109/asmc.2013.6552782
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
Traditional semiconductor manufacturing relies on statistical process control and human intervention as the fundamental method to change the process parameters to generate desired output. With the increase in demand for quality, yield, throughput, an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::694ad5c5f8cbc7c680cff7f8fe992ddd
https://doi.org/10.1109/asmc.2013.6552819
https://doi.org/10.1109/asmc.2013.6552819
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference; 2013, p275-279, 5p
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference; 2013, p93-98, 6p
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference; 2013, p1-9, 9p