Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Satoshi Sunohara"'
Autor:
Satoshi Sunohara, Toshiaki Asakura, Takashi Kimura, Shun Ozawa, Satoshi Oshima, Daigo Yamauchi, Akiko Tamakoshi
Publikováno v:
PLoS ONE, Vol 16, Iss 9, p e0257107 (2021)
Due to COVID-19, many countries including Japan have implemented a suspension of economic activities for infection control. It has contributed to reduce the transmission of COVID-19 but caused severe economic losses. Today, several promising vaccines
Externí odkaz:
https://doaj.org/article/a9a52066c703438aa7efdccd80d9ef94
Autor:
Toshiaki Asakura, Daigo Yamauchi, Satoshi Sunohara, Satoshi Oshima, Takashi Kimura, Akiko Tamakoshi, Shun Ozawa
Publikováno v:
PLoS ONE, Vol 16, Iss 9, p e0257107 (2021)
PLoS ONE
PLoS ONE
Due to COVID-19, many countries including Japan have implemented a suspension of economic activities for infection control. It has contributed to reduce the transmission of COVID-19 but caused severe economic losses. Today, several promising vaccines
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::947e268b0f85f2dd0355d55ba33bfd2d
https://doi.org/10.1101/2021.04.18.21255682
https://doi.org/10.1101/2021.04.18.21255682
Autor:
Yuichi Kato, Satoshi Sunohara, Muhammad Abbas Ahmad Zaini, Hideki Tatsumoto, Motoi Machida, Qingrong Qian
Publikováno v:
Applied Surface Science. 254:4868-4874
Activated carbons were prepared from cattle manure compost (CMC) using zinc chloride activation. The structural and surface chemical characteristics of CMC-based activated carbons were determined by N 2 adsorption–desorption and Boehm titration, re
Publikováno v:
Journal of the Japan Society of Waste Management Experts. 17:322-330
Autor:
Naoyuki Koizumi, Wataru Kaneda, Noriyoshi Shimizu, Hiromu Arisaka, Satoshi Sunohara, Toshinori Koyama, Akio Rokugawa
Publikováno v:
International Symposium on Microelectronics. 2013:000414-000414
In recent years, it has become apparent that the conventional FC-BGA (Flip Chip Ball Grid Array) substrate manufacturing method (Electroless Cu plating, Desmear, Laser Drilling processing) is reaching its limits for finer wiring dimensions and narrow